Patents by Inventor Bruce Wachtmann

Bruce Wachtmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor assembly with conductive rim and method of producing the same
    Publication number: 20060118946
    Abstract: An apparatus has first and second wafers, and a conductive rim between the first and second wafers. The conductive rim electrically and mechanically connects the first and second wafers. In addition, the conductive rim and second wafer at least in part seal an area on the surface of the first wafer.
    Type: Application
    Filed: October 11, 2005
    Publication date: June 8, 2006
    Inventors: Susan Alie, Bruce Wachtmann, Michael Judy, David Kneedler
  • MEMS device with conductive path through substrate
    Patent number: 6936918
    Abstract: A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: August 30, 2005
    Assignee: Analog Devices, Inc.
    Inventors: Kieran P. Harney, Lawrence E. Felton, Thomas Kieran Nunan, Susan A. Alie, Bruce Wachtmann
  • Conductive bond for through-wafer interconnect
    Publication number: 20050170609
    Abstract: A conductive bond for through-wafer interconnect is produced by forming an electrode through a first wafer from a component on a front side of the first wafer to a back side of the first wafer, forming a first electrically conductive interface in contact with an exposed portion of the electrode on the back side of the first wafer, and conductively bonding the first electrically conductive interface with a second electrically conductive interface on a second wafer under pressure at a temperature below the thermal budget of the stacked wafer device. The process temperature is generally well below the melting points of the electrically conductive interfaces. In some embodiments, the conductive bonding may be facilitated or enabled by performing the conductive bonding in a vacuum.
    Type: Application
    Filed: February 3, 2005
    Publication date: August 4, 2005
    Inventors: Susan Alie, Bruce Wachtmann, Lawrence Felton, Changhan Yun
  • MEMS DEVICE WITH CONDUCTIVE PATH THROUGH SUBSTRATE
    Publication number: 20050127499
    Abstract: A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
    Type: Application
    Filed: April 19, 2004
    Publication date: June 16, 2005
    Inventors: Kieran Harney, Lawrence Felton, Thomas Kieran Nunan, Susan Alie, Bruce Wachtmann
  • Semiconductor assembly with conductive rim and method of producing the same
    Publication number: 20050127525
    Abstract: An apparatus has first and second wafers, and a conductive rim between the first and second wafers. The conductive rim electrically and mechanically connects the first and second wafers. In addition, the conductive rim and second wafer at least in part seal an area on the surface of the first wafer.
    Type: Application
    Filed: December 15, 2003
    Publication date: June 16, 2005
    Inventors: Susan Alie, Bruce Wachtmann, Michael Judy, David Kneedler