Abstract: A method for producing an input/output permutation of several conductive strips on an integrated circuit consists in: identifying, among the parallel branches of the conductive strips, a minimal group whereof the branches are designed to be subjected to input/output swapping; locating a bend (3) on a deflected branch (2) and carrying out a conductive deposit (5) perpendicular from said bend (3) between the two parallel branches (1, 2), and an inclined deposit (9) between the perpendicular branch (4) and the parallel branch (1) with breaks (7, 8) so as to swap the inputs and the outputs. The invention also concerns the resulting integrated circuit.

Abstract: The invention relates to a process and an installation for automatic optimal location of a servicing operation on an integrated circuit. The accessible polygons are retrieved on the basis of topographic descriptive data and data representing the electrical circuit. For each step, different execution options are determined, each corresponding to each of the different accessible polygons, and a rating is calculated and assigned to each execution option as a function of the depth of each possible initial polygon with respect to the access surface, and of accessibility parameters of each possible initial polygon, and the optimal execution option to be used for executing each step of the servicing operation is determined automatically by a numerical optimization calculation using the ratings assigned to the different execution options of each step of the servicing operation.

Abstract: The installation for microscopic observation of a semiconductor electronic circuit includes, in a vacuum, a reflection particle interaction microscope and parts for supporting the circuit facing the reflection particle interaction microscope. The installation further includes a reflection optical microscope including optical observation part and elements for illuminating the circuit to be observed, with the illumination elements and the optical observation part on the same side of the circuit and the reflection optical microscope and the reflection particle interaction microscope disposed face-to-face on a common observation axis on respective opposite sides of the circuit.