Abstract: Aluminum alloy strips less than 0.3 mm thick for making heat exchangers, containing, in wt. %: Si<1.0, Fe<1.0, Cu<0.8, Mg<1.0, Mn?1.8, Zn<2.0, In<0.2, Sn<0.2, Bi<0.2, Ti<0.2, Cr<0.25, Zr<0.25, Si+Fe+Mn+Mg>0.8, other elements <0.05, each and <0.15 in total. The strips have between the surface and half the thickness a difference of corrosion potential, measured relative to a saturated calomel electrode in accordance with the ASTM G69 standard, of at least 10 mV. The invention also concerns a method for making such strips by continuous casting in conditions promoting formation of segregations in the strip core, optionally hot rolling, cold rolling optionally with one or several intermediate or final annealing(s) of 1 to 20 hours at a temperature between 200 and 450° C. The fins or separators made from the inventive strips have enhanced resistance to perforating corrosion.

Abstract: The invention relates to a thin strip or foil, having a thickness of 6 to 200 ?m, preferably, of 6 to 50 ?m, and composed of an alloy containing (in weight %) Si: 1.0 to 1.5, Fe: 1.0 to 1.5, Cu <0.2, Mn <0.1, other elements <0.05 each up to a total <0.15, the remainder being Al. The annealed thin strip or foil has a tensile strength Rm >110 MPa for a thickness >9 ?m and >100 MPa for a thickness of 6 to 9 ?m, and an elastic limit R0.2 >70 MPa. Preferably, said alloy has a silicon content of 1.1 to 1.3% and an iron content of 1.0 to 1.2%. The aforementioned thin strips or foils may be used especially for the production of multilayer composites, overcaps for bottles or aluminium wrappings.

Abstract: Aluminum alloy strips less than 0.3 mm thick for making heat exchangers, containing, in wt. %: Si<1.0, Fe<1.0, Cu<0.8, Mg<1.0, Mn?1.8, Zn<2.0, In<0.2, Sn<0.2, Bi<0.2, Ti<0.2, Cr<0.25, Zr<0.25, Si+Fe+Mn+Mg>0.8, other elements <0.05, each and <0.15 in total. The strips have between the surface and half the thickness a difference of corrosion potential, measured relative to a saturated calomel electrode in accordance with the ASTM G69 standard, of at least 10 mV. The invention also concerns a method for making such strips by continuous casting in conditions promoting formation of segregations in the strip core, optionally hot rolling, cold rolling optionally with one or several intermediate or final annealing(s) of 1 to 20 hours at a temperature between 200 and 450° C. The fins or separators made from the inventive strips have enhanced resistance to perforating corrosion.

Abstract: The object of the invention is a method for manufacturing aluminum alloy strips with a thickness less than or equal to 12 &mgr;m, including:

Abstract: A method for manufacturing aluminum alloy strips with a thickness less than or equal to 12 &mgr;m, by obtaining an alloy with composition (weight %): Si:0.15-0.40; Fe: 1.10-1.70; Mg<0.02; Mn:0.30-0.50; other elements <0.05 each and total <0.15; remainder aluminum; continuously casting between rolls a strip of this alloy with a thickness between 2 and 10 mm; homogenizing this strip at a temperature between 450 and 620° C. with a duration between 8 and 40 hrs; cold-rolling of the homogenized strip; intermediate annealing of this cold-rolled strip to a temperature between 200 and 400° C., and with a duration between 8 and 15 hrs; cold-rolling of the annealed strip up to the final thickness less than or equal to 12 &mgr;m; and final annealing of the strip at a temperature between 200 and 300° C., with a duration of at least 50 hrs. The method is notably applied to the manufacturing of strips for aseptic food packages of the brick type.

Abstract: The object of the invention is a method for manufacturing aluminum alloy strips with a thickness less than or equal to 12 &mgr;m, including:

Abstract: The invention concerns a cathode pulverization target characterized in that its active part, i.e. the volume of the target capable of being removed during the cathode pulverization, consists of a high purity aluminum alloy simultaneously containing copper and iron and having simultaneously a recrystallization temperature well above 20° C. and an electric resistivity less than 2.85 &mgr;&OHgr;.cm at 20° C. The use of the target for making bonding circuits reduces the frequency at which voids and hillocks appear, while maintaining the resistance of the bonding circuits at values comparable to the resistance obtained with a high purity aluminum alloy, while also providing the etching characteristics comparable to those of high purity aluminum alloy.