Abstract: A bridge clip can provide off center loading between a lid and a semiconductor package during curing of adhesive for attachment of the lid to the integrated circuit die. This may be done, in some embodiments, without requiring an inventory of different parts and a variety of different assembly techniques by providing a leaf spring on the bridge clip which may be adapted for off center loading. The leaf spring may have its apex or centroid displaced with respect to the length of the bridge clip, transversely thereto or some combination thereof as needed. Thus, in some embodiments, a different leaf spring is all that needs to be provided to implement off center loading.

Abstract: A bridge clip with a leaf holds an integrated heat spreader on a die during curing. The leaf may have at least two metal portions with different coefficients of thermal expansion (CTE) to exert a changing force on the heat spreader over temperature. The die may be coupled to the heat spreader with a polymer interface material which is cured at an elevated temperature. In embodiments in which the die is located off-center under the heat spreader, the clip may exert an off-center force on the heat spreader when curing at the elevated temperature due to the differing CTEs. In other embodiments, in which the die is located toward the center of the heat spreader, a leaf with two layers having different CTEs may help reduce variable contact geometry, which may be especially helpful in higher force situations.