Patents by Inventor Bruno Fürbacher

Bruno Fürbacher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a dielectric layer on a component
    Patent number: 9394163
    Abstract: A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: July 19, 2016
    Assignee: EPCOS AG
    Inventors: Charles Binninger, Christoph Eggs, Bruno Fuerbacher, Ulrich Knauer, Manfred Maisch, Helmut Zottl
  • Method for Producing a Dielectric Layer on a Component
    Publication number: 20130126466
    Abstract: A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.
    Type: Application
    Filed: April 13, 2011
    Publication date: May 23, 2013
    Applicant: EPCOS AG
    Inventors: Charles Binninger, Christoph Eggs, Bruno Fuerbacher, Ulrich Knauer, Manfred Maisch, Helmut Zottl
  • Planar resist structure, in particular an encapsulation for electronic component, and thermomechanical production process
    Patent number: 6462272
    Abstract: In a thermomechanical process for planarizing a resist layer applied to a partly elevated carrier area, a resist structure, in particular an encapsulation for electronic components, is obtained. In this case, a dry resist sheet, formed of a composite of a temperature-resistant protective sheet and a photosensitive layer, is applied by its photosensitive layer to a surface of the carrier and the dry resist sheet is planarized under pressure and with heat. After which the photosensitive layer is exposed, and the protective sheet is removed and the photosensitive layer is developed.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: October 8, 2002
    Assignee: Epcos AG
    Inventor: Bruno Fürbacher
  • Method for producing an encapsulation for a SAW component operating with surface acoustic waves
    Patent number: 6446316
    Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: September 10, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Bruno Fürbacher, Friedrich Lupp, Wolfgang Pahl, Günter Trausch