Patents by Inventor Bruno Furbacher

Bruno Furbacher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermomechanical process for producing a planar resist structure
    Publication number: 20030000724
    Abstract: In a thermomechanical process for planarizing a resist layer applied to a partly elevated carrier area, a resist structure, in particular an encapsulation for electronic components, is obtained. In this case, a dry resist sheet, formed of a composite of a temperature-resistant protective sheet and a photosensitive layer, is applied by its photosensitive layer to a surface of the carrier and the dry resist sheet is planarized under pressure and with heat. After which the photosensitive layer is exposed, and the protective sheet is removed and the photosensitive layer is developed.
    Type: Application
    Filed: July 25, 2002
    Publication date: January 2, 2003
    Applicant: Epcos AG
    Inventor: Bruno Furbacher
  • Planar resist structure, in particular an encapsulation for electronic component, and thermomechanical production process
    Patent number: 6462272
    Abstract: In a thermomechanical process for planarizing a resist layer applied to a partly elevated carrier area, a resist structure, in particular an encapsulation for electronic components, is obtained. In this case, a dry resist sheet, formed of a composite of a temperature-resistant protective sheet and a photosensitive layer, is applied by its photosensitive layer to a surface of the carrier and the dry resist sheet is planarized under pressure and with heat. After which the photosensitive layer is exposed, and the protective sheet is removed and the photosensitive layer is developed.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: October 8, 2002
    Assignee: Epcos AG
    Inventor: Bruno Fürbacher
  • Method for producing an encapsulation for a SAW component operating with surface acoustic waves
    Patent number: 6446316
    Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: September 10, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Bruno Fürbacher, Friedrich Lupp, Wolfgang Pahl, Günter Trausch
  • Encapsulation for electronic components and method for producing the encapsulation
    Patent number: 5831369
    Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
    Type: Grant
    Filed: November 4, 1996
    Date of Patent: November 3, 1998
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Bruno Furbacher, Friedrich Lupp, Wolfgang Pahl, Gunter Trausch