Abstract: The present invention relates to a method for temporarily fixing two planar workpieces, in particular a processed wafer and a carrier wafer. A thin layer is first applied to the sides of the two workpieces that have to be connected, and the coated sides of the workpieces are then connected by means of a bonding agent. Care should be taken that the thin layers can preferably be applied easily and removed without leaving any residues. The bonding agent, which actually causes the bond, needs only be selected with respect to its chemical resistance and its mechanical and adhesive properties.