Abstract: A system and a method are disclosed for implementing distributed processing in edge nodes. In an embodiment, a respective edge node receives data from a client of the respective edge node. The respective edge node generates a prediction of a respective activity based on the data, and determines whether the prediction is valid by feeding the prediction into a validator module and receiving a validation response from the validator module. The respective edge node, in response to determining that the prediction is valid, activates a function.

Abstract: A system and a method are disclosed for implementing distributed processing in edge nodes. In an embodiment, a respective edge node receives data from a client of the respective edge node. The respective edge node generates a prediction of a respective activity based on the data, and determines whether the prediction is valid by feeding the prediction into a validator module and receiving a validation response from the validator module. The respective edge node, in response to determining that the prediction is valid, activates a function.

Abstract: This overfill prevention system probe for tanks for transport of liquid fuels comprises a level detector mounted on a support that is fixed to the tank so that the detector is placed in the compartment at a maximum permissible filling height. The level detector includes a measuring sensor comprising a set of several electrodes and means for measuring the dielectric permittivity of a fluid present between the electrodes. The probe also comprises means for testing the satisfactory operation of the entire acquisition chain of the dielectric permittivity measurement of the fluid present at the electrodes.

Abstract: This overfill prevention system probe for tanks for transport of liquid fuels comprises a level detector mounted on a support that is fixed on the tank so that the detector is placed in the tank at a maximum permissible filling height. The level detector includes a measuring sensor capable of providing a redundant level measurement.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: Methods for wet cleaning quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: In a postage meter including a print module for printing on mail items, a feed tray for feeding in mail items to said print module, and a collection tray for receiving the mail items once they have been franked by the print module, said feed tray is inclined in two directions so that the mail items disposed on said tray are brought by gravity against a retractable jogging flap into the same determined position at which said print module affixes a postal imprint.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: In a postage meter including a print module for printing on mail items, a feed tray for feeding in mail items to said print module, and a collection tray for receiving the mail items once they have been franked by the print module, said feed tray is inclined in two directions so that the mail items disposed on said tray are brought by gravity against a retractable jogging flap into the same determined position at which said print module affixes a postal imprint.

Abstract: A non-destructive and simple method for cleaning a new or used electrostatic chuck comprises a wet cleaning process, which removes contaminants deposited on a surface of the electrostatic chuck.

Abstract: A non-destructive and simple method for cleaning a new or used electrostatic chuck comprises a wet cleaning process, which removes contaminants deposited on a surface of the electrostatic chuck.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: Methods for wet cleaning quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times.

Abstract: In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.

Abstract: In chemical mechanical polishing, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.

Abstract: A method of removing a set of particles from a set of structures including yttrium oxide is disclosed. The method includes exposing the set of structures to a first solution including an oxidizer for a first period. The method also includes removing the set of structures from the first solution, and exposing the set of structures to a second solution including a keytone reagent for a second period. The method further includes removing the set of structures from the second solution, and mechanically rubbing the set of structures with a third solution including a first set of acids for a third period.

Abstract: In chemical mechanical polishing, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.