Abstract: The invention relates to a method for transferring surface structures such as interference layers, holograms, and other highly refractive optical microstructures to substrates. The aim of the invention is to devise a method which is used for transferring surface structures such as interference layers, holograms, and other highly refractive optical microstructures to substrates and can also be used in a high temperature range. The aim is achieved by a method comprising the following steps: a) a flexible intermediate support layer is applied to a support film as a release layer; b) an embossed sol is applied to the intermediate support layer and is provided with a surface structure; c) a stack encompassing a binder layer and the surface structure is produced; d) the support film is removed; e) the workpiece is thermally treated.

Abstract: The invention relates to a method for transferring surface structures such as interference layers, holograms, and other highly refractive optical microstructures to substrates. The aim of the invention is to devise a method which is used for transferring surface structures such as interference layers, holograms, and other highly refractive optical microstructures to substrates and can also be used in a high temperature range. The aim is achieved by a method comprising the following steps: a) a flexible intermediate support layer is applied to a support film as a release layer; b) an embossed sol is applied to the intermediate support layer and is provided with a surface structure; c) a stack encompassing a binder layer and the surface structure is produced; d) the support film is removed; e) the workpiece is thermally treated.

Abstract: A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications.

Abstract: A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications.