Abstract: Disclosed herein are methods, pharmaceutical compositions, and vaccines for modulating an immune response. Also disclosed herein are methods, pharmaceutical compositions, and vaccines for inducing an immune response.

Abstract: Polymers formed from anhydrides of the formula I ##STR1## in which R.sub.1 and R.sub.2 independently of one another are hydrogen or methyl.The novel polymers are suitable for use as curing agents for polyepoxide compounds.

Abstract: Polymers formed from anhydrides of the formula I ##STR1## in which R.sub.1 and R.sub.2 independently of one another are hydrogen or methyl.The novel polymers are suitable for use as curing agents for polyepoxide compounds.

Abstract: The invention relates to epoxy resin moulding compositions containing(a) at least one epoxy resin adduct of a low molecular diglycidyl ether of a bisphenol and an aromatic or cycloaliphatic diamine that contains not less than 2.0 epoxide equivalents/kg of resin,(b) at least one aromatic polyol containing more than 5 hydroxyl equivalents/kg of polyol as hardener, the amount of said hardener being such that the content of hydroxyl groups is 0.5 to 0.8 per epoxy group,(c) at least one curing accelerator,(d) up to 70% by weight of aluminium hydroxide and(e) 1-20% by weight of a calcium phosphate, the amount of components (d) and (e) together being not more than 85% by weight and the percentages by weight being based on the total weight of the epoxy resin moulding composition.These moulding compositions are self-extinguishing and have good tracking resistance. They are suitable e.g. for making electrical components.

Abstract: The invention relates to heat curable epoxy resin compositions consisting of an epoxy resin containing, on average, more than one epoxide group per molecule, an aromatic onium salt as catalyst, a copper complex compound as co-catalyst, and a light stabilizer. These compositions are less sensitive to UV irradiation and have a good shelf life at room temperature as well as a good high temperature reactivity.

Abstract: The invention relates to epoxy molding compositions consisting of diglycidyl ethers of bisphenols, anhydride hardeners and reinforcing fillers. At least half the total amount of filler consists of wollastonite. These molding compositions have greater resistance to cracking, which is particularly advantageous in encasing metal parts.

Abstract: A moulding composition consisting of an epoxy resin adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine together with a filler, an accelerator, and an aromatic polyol as hardener. Mouldings having excellent resistance to cracking can be obtained from this moulding composition.

Abstract: According to the invention, polyaddition products containing imide groups are manufactured by reacting certain polyimides (preferably maleimides) with polyhydric phenols in the presence of basic compounds. The preferred embodiment (A) relates to the use of catalysts as basic compounds. In particular, tertiary, secondary or mixed tertiary-secondary amines can be used. A further embodiment (B) relates to the use of primary polyamines as basic compounds. In the latter case, the polyamine participates in the polyaddition mechanism, that is to say the molecules are incorporated into the polyaddition products. In this latter case, catalysts can also be used additionally.The invention can be utilized particularly in the fields of surface protection, the electrical industry, laminating processes and the manufacture of foamed plastics, and in the building industry.

Abstract: Reaction products, containing phenolic hydroxyl groups, of polysiloxanes and polyphenols are obtained by reacting alkoxy-terminated or acyloxy-terminated polysiloxane compounds with polyphenols at elevated temperature, employing 1.2 to 10 equivalents of phenolic hydroxyl groups per 1 equivalent of alkoxy group or acyloxy group. The reaction products containing hydroxyl groups can be used for curing and modifying epoxide resins and give flexible, hydrophobic plastics of valuable mechanical and dielectric properties.

Abstract: Storage-stable epoxide moulding compositions containing solid pre-adducts of triglycidyl isocyanurate and amine curing agents, fillers and release agents. After curing, these compositions form tracking-resistant plastics of high heat distortion point.

Abstract: The invention relates to storage-stable, quick-curing epoxide resin moulding materials containing:A. epoxide resins,B. pre-adducts containing free amino groups and formed from polyamines containing aromatic groups and low-molecular epoxide resins, as curing agents, andC. mineral or organic pulverulent or fibrous fillers, with the epoxide resins and the curing agents softening between 45.degree. and 120.degree. C, and having a melting point higher by 5.degree. to 30.degree. C than the softening point, and being present in the said moulding materials predominantly in the form of particles separated from each other. The moulded articles have good mechanical and dielectrical properties.

Abstract: Storage-Stable moulding compositions which contain solid adducts, containing epoxide groups, of triglycidyl-bis-hydantoins or triglycidyl-bis-dihydrouracils and organic compounds possessing several active hydrogen atoms, solid adducts, containing amino groups, of cycloaliphatic, heterocyclic or aromatic polyamines as curing agents, and fillers. The moulding compositions are used for the manufacture of light-stable and tracking-resistant plastics.

Abstract: The invention relates to storage-stable, quick-curing epoxide resin moulding materials containing:A. pre-adducts containing aromatic constituents and free epoxide groups and formed from epoxide resins and polyamines,B. pre-adducts containing free amino groups and formed from polyamines containing cycloaliphatic or heterocyclic groups with polyglycidyl compounds, as curing agents, andC. mineral or organic pulverulent or fibrous fillers, with the epoxide resin pre-adducts and the curing agents softening between 45.degree. and 120.degree.C, and melting 5.degree. to 30.degree.C above the softening point, and the resin pre-adducts and the curing agents being present in the moulding materials predominantly in the form of particles separated from each other.The moulded articles are distinguished by very good stability to solar and UV rays, and retain their original colour to a very considerable extent even after prolonged irradiation.