Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Abstract: A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Abstract: Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.

Abstract: Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.

Abstract: An input control for controlling various features of an electronic device is described. The input control can be positioned along an exterior surface of the electronic device and cover an opening leading into the electronic device. A pressure sensor can then be positioned within the electronic device and adjacent to the covered opening. The pressure sensor is able to measure a pressure of a volume of air positioned between the pressure sensor and the input control. When movement of the input control changes the pressure of the volume of air, the sensor readings from the pressure sensor can be used to register a user input. The input control can take many forms including rocker buttons, slider switches and input regions.

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

Abstract: An input control for controlling various features of an electronic device is described. The input control can be positioned along an exterior surface of the electronic device and cover an opening leading into the electronic device. A pressure sensor can then be positioned within the electronic device and adjacent to the covered opening. The pressure sensor is able to measure a pressure of a volume of air positioned between the pressure sensor and the input control. When movement of the input control changes the pressure of the volume of air, the sensor readings from the pressure sensor can be used to register a user input. The input control can take many forms including rocker buttons, slider switches and input regions.

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.