Abstract: The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.

Abstract: A system, method and an apparatus are provided for imaging a target object, such as, e.g. a pipeline or aircraft, and may include an articulated segmented x-ray detector comprising a plurality of individual x-ray detector segments, which may be CMOS detectors or other type of semiconductor detector, articulately connected to one another. The articulately connections permit rotation of each x-ray detector segments which also permits conformity to the shape of a target object. A camera controller may be connected to each of the plurality of individual x-ray detector segments for receiving image data from each individual x-ray detectors. A flexible mat containing x-ray blocking objects may be connected to the articulated segmented x-ray detector to provide reference potions in the image data and for use in processing the image data.

Abstract: The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.