Patents by Inventor Bryan E. Ake

Bryan E. Ake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINTERED 17-4PH STEEL PART AND METHOD FOR FORMING
    Publication number: 20110286874
    Abstract: A method of sintering a 17-4PH alloy powder and a sintered 17-4PH sintered part are disclosed. The part is formed by selective laser sintering a 17-4PH alloy powder and binder mixture to form a green part that is sintered to form a part having a substantially pure martensitic structure. The metal powder includes boron. The sintered part may be further processed by shot peening to improve crack resistance.
    Type: Application
    Filed: August 5, 2011
    Publication date: November 24, 2011
    Applicant: THE BOEING COMPANY
    Inventors: Steven C. LOW, Jerry G. CLARK, Neal W. MUYLAERT, Richard J. NORD, Blair E. THOMPSON, Bryan E. AKE, Reid W. WILLIAMS
  • Direct to metal sintering of 17-4PH steel
    Patent number: 8017070
    Abstract: A method of sintering a 17-4PH alloy powder and a sintered 17-4PH sintered part are disclosed. The part is formed by selective laser sintering a 17-4PH alloy powder and binder mixture to form a green part that is sintered to form a part having a substantially pure martensitic structure. The metal powder includes boron. The sintered part may be further processed by shot peening to improve crack resistance.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: September 13, 2011
    Assignee: The Boeing Company
    Inventors: Steven C. Low, Jerry G. Clark, Neal W Muylaert, Richard J. Nord, Blair E. Thompson, Bryan E. Ake, Reid W. Williams
  • DIRECT TO METAL SINTERING OF 17-4PH STEEL
    Publication number: 20090208361
    Abstract: A method of sintering a 17-4PH alloy powder and a sintered 17-4PH sintered part are disclosed. The part is formed by selective laser sintering a 17-4PH alloy powder and binder mixture to form a green part that is sintered to form a part having a substantially pure martensitic structure. The metal powder includes boron. The sintered part may be further processed by shot peening to improve crack resistance.
    Type: Application
    Filed: May 17, 2007
    Publication date: August 20, 2009
    Applicant: THE BOEING COMPANY
    Inventors: Steven C. LOW, Jerry G. CLARK, Neal W. MUYLAERT, Richard J. NORD, Blair E. THOMPSON, Bryan E. AKE, Reid W. WILLIAMS
  • Thermocouple control system for selective laser sintering part bed temperature control
    Patent number: 6822194
    Abstract: A temperature control system for use in a selective laser sintering machine is provided that comprises a thermocouple disposed within a part bed of the selective laser sintering machine and a temperature transmitter in communication with the thermocouple. The temperature transmitter is incorporated into existing control circuitry of the selective laser sintering machine, and the control circuitry is in communication with control logic, which controls the part bed temperature, among other process parameters. In operation, the thermocouple senses and communicates the part bed temperature to the temperature transmitter, and the control circuitry communicates the part bed temperature to the control logic to control part bed temperature during a part build.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: November 23, 2004
    Assignee: The Boeing Company
    Inventors: Steven C. Low, Bryan E. Ake
  • Thermocouple control system for selective laser sintering part bed temperature control
    Publication number: 20030222066
    Abstract: A temperature control system for use in a selective laser sintering machine is provided that comprises a thermocouple disposed within a part bed of the selective laser sintering machine and a temperature transmitter in communication with the thermocouple. The temperature transmitter is incorporated into existing control circuitry of the selective laser sintering machine, and the control circuitry is in communication with control logic, which controls the part bed temperature, among other process parameters. In operation, the thermocouple senses and communicates the part bed temperature to the temperature transmitter, and the control circuitry communicates the part bed temperature to the control logic to control part bed temperature during a part build.
    Type: Application
    Filed: May 29, 2002
    Publication date: December 4, 2003
    Inventors: Steven C. Low, Bryan E. Ake