Abstract: A device is disclosed for supporting semiconductor wafers or other polished, opaque plates for processing or metrology in a vertical orientation, where the wafer loading and unloading occurs in a horizontal orientation. The device consists of a pallet designed with an opening such that both sides of the wafer are exposed. The wafer is loaded into the pallet to rest on three fixed rest members extending a short distance into the opening. Moving clamp members on the frame are located for movement toward or away from the corresponding rest members. Two cylindrical rest pins are located on axes parallel to the central axis of the opening to permit the wafer to rest under the force of gravity on the rest pins when the frame is rotated to its vertical position. Special provisions are made to minimize the effects of mechanical vibration of the wafer while insuring a robust physical restraint of the wafer within the apparatus without inducing mechanical stresses which could influence the shape of the wafer.

Abstract: A device is disclosed for supporting semiconductor wafers or other polished, opaque plates for processing or metrology in a vertical orientation, where the wafer loading and unloading occurs in a horizontal orientation. The device consists of a pallet designed with an opening such that both sides of the wafer are exposed. The wafer is loaded into the pallet to rest on three fixed rest members extending a short distance into the opening. Moving clamp members on the frame are located for movement toward or away from the corresponding rest members. Two cylindrical rest pins are located on axes parallel to the central axis of the opening to permit the wafer to rest under the force of gravity on the rest pins when the frame is rotated to its vertical position. Special provisions are made to minimize the effects of mechanical vibration of the wafer while insuring a robust physical restraint of the wafer within the apparatus without inducing mechanical stresses which could influence the shape of the wafer.

Abstract: A housing for a remote interface unit is shown. The housing has a geometry to be appropriate for use with a small data processing system. The housing contains an upper and lower sections that permit convenient assembly and disassembly and, when assembled are securely fastened together with only two coupling units, such as screws. Expansion modules can be coupled to or removed from the unit circuit board without the use of tools, and typically with only one hand.

Abstract: Method for packaging an expandable remote interface unit. The method includes providing a unit circuit board to which a plurality of expansion module interface boards may be detachably coupled without making a permanent connection. The unit circuit board and at least one expansion module interface boards are preferably housed in an enclosure which admits of easy disassembly, so that expansion module interface boards may be added or deleted without the need for soldered connections.

Abstract: A housing for a remote interface unit is shown. The housing has a geometry to be appropriate for use with a small data processing system. The housing contains an upper and lower sections that permit convenient assembly and disassembly and, when assembled are securely fastened together with only two coupling units, such as screws. Expansion modules can be coupled to or removed from the unit circuit board without the use of tools, and typically with only one hand.