Abstract: The device incorporates a support member (1) for the circuit package (13); a plurality of contact elements (4) for connection with the conductive terminations mounted on the support member each of the contact elements being resiliently biassed away from its associated conductive terminations (16) and means (12) for selectively exerting pressure upon the contact elements so as to urge them into contact with their associated conductive terminations to facilitate soldering and after such soldering to facilitate the removal of the circuit package (13) if and when desired, by allowing the pressure to be removed so that on de-soldering the resilient loading on a contact (4) will cause it automatically to spring away from the associated conductive terminations.