Abstract: Described is a closure adapted to be fit on top of containers such as bottles. In various embodiments, the closure may include an outer skirt and an inner skirt. The closure may be engageable with a container neck. In some embodiments, a region of weakness may be adapted to break and/or deform upon an attempt to remove the closure from the container neck. In some embodiments, after the break and/or deformation, the closure may no longer be engageable with the container neck.

Abstract: Disclosed herein is a closure containing a top deck, an inner skirt and an outer skirt. The inner skirt engages the neck of a bottle via a snap fitting. The closure contains regions of weakness such that once the inner skirt engages the neck of the bottle and the regions of weakness are broken, the closure cannot be removed from the bottle neck without disabling the snap engagement between the closure and neck, thus preventing refilling and reuse of the bottle.

Abstract: Described is a closure adapted to be fit on top of containers such as bottles. In various embodiments, the closure may include an outer skirt and an inner skirt. The closure may be engageable with a container neck. In some embodiments, a region of weakness may be adapted to break and/or deform upon an attempt to remove the closure from the container neck. In some embodiments, after the break and/or deformation, the closure may no longer be engageable with the container neck.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.