Patents by Inventor Bryan J. Zart

Bryan J. Zart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8401649
    Abstract: The disclosure describes an axial lead connector assembly for an implantable medical device (IMD). The lead connector assembly facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: March 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Carole A. Tronnes, Robert A. Munoz, Alexander O. Lakanu, John M. Swoyer, Greg A. Theis, Bryan J. Zart, David J. DeSmet
  • Patent number: 7881765
    Abstract: Apparatus and method according to the disclosure relate to minimizing gaps between a substantially planar cardiac-sensing electrode and a shroud member utilizing a so-called interference-fit. For example, a relatively recessed area or aperture formed in an exemplary resin-based shroud member has slightly reduced dimensions relative to the electrode and requires compression forces during assembly (e.g., manually or in an automated process including a press, a tool or other means). The interference-fit promotes a very tight fit (or seal) between the metallic electrode and the resin-based shroud member and, importantly, minimizes gaps. Additionally, discrete interference structures promote fluid tight seals between the electrode and a recess or aperture adapted to receive the electrode.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: February 1, 2011
    Assignee: Medtronic, Inc.
    Inventors: John C. Mertz, Bryan J. Zart, James Strom, Michael D. Fletcher, John E. Nicholson, Steven J. Fischer
  • Patent number: 7835793
    Abstract: Apparatus and method for fabricating a shroud member having extra-cardiac sensing electrode. The assembly is used to provide a subcutaneous cardiac activity sensing device via at least a pair of electrodes mechanically coupled to the shroud member. In one embodiment only a major surface portion of the electrodes are exposed to body fluid and tissue. One beneficial aspect of the fabrication techniques herein involve the encapsulation of the elongated conductors and a majority of the electrode surfaces thereby reducing possibility for electrical shorting among the IMD housing and the other conductive members. The assemblies provided can be fabricated efficiently, inexpensively, quickly and easily using insert-molding techniques.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: November 16, 2010
    Assignee: Medtronic, Inc.
    Inventors: Alexandra M. Koch, Steven J. Fischer, Alexander O. Lakanu, Bryan J. Zart
  • Publication number: 20100285697
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: July 21, 2010
    Publication date: November 11, 2010
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20100035453
    Abstract: The disclosure describes an axial lead connector assembly for an implantable medical device (IMD). The lead connector assembly facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 11, 2010
    Applicant: Medtronic, Inc.
    Inventors: Carole A. Tronnes, Robert A. Munoz, Alexander O. Lakanu, John M. Swoyer, Greg A. Theis, Bryan J. Zart, David J. DeSmet
  • Patent number: 7590451
    Abstract: An axial lead connector assembly for an implantable medical device (IMD) facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: September 15, 2009
    Assignee: Medtronic, Inc.
    Inventors: Carole A. Tronnes, Robert A. Munoz, Alexander O. Lakanu, John M. Swoyer, Greg A. Theis, Bryan J. Zart, David J. DeSmet
  • Patent number: 7537493
    Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: May 26, 2009
    Assignee: Medtronics, Inc.
    Inventors: Andrew J. Ries, Jay K. Lahti, George Patras, John D. Longtin, Bryan J. Zart
  • Publication number: 20090017700
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: September 24, 2008
    Publication date: January 15, 2009
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7472505
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: January 6, 2009
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20080268720
    Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
    Type: Application
    Filed: July 11, 2008
    Publication date: October 30, 2008
    Inventors: ANDREW J. RIES, JAY K. LAHTI, GEORGE PATRAS, JOHN D. LONGTIN, BRYAN J. ZART
  • Patent number: 7413482
    Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: August 19, 2008
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jay K. Lahti, George Patras, John D. Longtin, Bryan J. Zart
  • Publication number: 20080183233
    Abstract: Apparatus and method according to the disclosure relate to an apparatus and methods for fabricating a shroud member having extra-cardiac sensing electrode coupled thereto and adapted to mechanically and electrically couple to an implantable medical device (IMD). The assembly is used to provide a subcutaneous cardiac activity sensing device via at least a pair of electrodes mechanically coupled to the shroud member. In one embodiment only a major surface portion of the electrodes are exposed to body fluid and tissue. One beneficial aspect of the fabrication techniques herein involve the encapsulation of the elongated conductors and a majority of the electrode surfaces thereby reducing possibility for electrical shorting among the IMD housing and the other conductive members. The assemblies provided according to the disclosure can be fabricated efficiently, inexpensively, quickly and easily using insert-molding techniques.
    Type: Application
    Filed: January 31, 2007
    Publication date: July 31, 2008
    Inventors: Alexandra M. Koch, Steven J. Fischer, Alexander O. Lakanu, Bryan J. Zart
  • Patent number: 7309262
    Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: December 18, 2007
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Andrew J. Ries, Brian R. Burwick, John E. Nicholson, Jay K. Lahti, Gregory A. Theis
  • Patent number: 7175482
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: February 13, 2007
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 6817905
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: November 16, 2004
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20030069612
    Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts.
    Type: Application
    Filed: June 20, 2001
    Publication date: April 10, 2003
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis