Patents by Inventor Bryan K. Douglas

Bryan K. Douglas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for providing electrical access to devices in a multi-chip module
    Patent number: 5396032
    Abstract: Multi-chip module (MCM) (10) includes package body (12) having cavity (20) for accepting a plurality of devices and substrates and seal ring (26) to ensure the integrity of the package. Lead frame (18) having a plurality of individual leads (28) is coupled to the package body (12). Plurality of test points (38) or test pins (30) are located on the external surface of package body (12). A plurality of bond pads are located in cavity (20), including a first set or tier and a second set or tier of bond pads for electrically coupling the devices and substrates in the cavity (20) external to package body (12). The first set or tier of bond pads provides electrical connection between the individual devices in MCM (10) to plurality of test points (38) or test pins (30), and the second set or tier of bond pads provides electrical connection between the individual devices in MCM (10) and plurality of individual leads (28).
    Type: Grant
    Filed: May 4, 1993
    Date of Patent: March 7, 1995
    Assignee: Alcatel Network Systems, Inc.
    Inventors: Harry B. Bonham, Jr., Charles R. Pratt, III, Bryan K. Douglas