Abstract: The present disclosure provides various embodiments of arrays and methods for manufacturing arrays. In one aspect, the present disclosure provides a method for manufacturing arrays. The method may comprise (a) processing a source material to form a plurality of elongated features; (b) depositing one or more films on a surface portion of the elongated features; (c) forming one or more electrical interconnections between (i) the elongated features and (ii) one or more active electronic components for processing one or more signals that are transmitted or received by or through the elongated features; (d) creating a needle array from the plurality of elongated features; and (e) dicing said needle array to form an array comprising a plurality of discrete electrodes. The one or more films may be configured to modify a property of the surface portion of the elongated features to enable or facilitate the one or more electrical interconnections.