Patents by Inventor Bryan Lee Hash

Bryan Lee Hash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for reducing noise on integrated circuit using broken die seal
    Patent number: 10971419
    Abstract: A die seal is broken in at least one place for a conductor strip formed on each conductor layer. Accordingly, no current can flow in a circular pattern around the entire perimeter of the chip. In some embodiments, an angled slot is provided in the original die seal. The angled slots may be vertically aligned. Alternatively, the slots may be vertically staggered or straight. When vertically staggered, the slots on each conductor layer are vertically offset.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: April 6, 2021
    Assignee: pSemi Corporation
    Inventors: Bryan Lee Hash, Ronald Eugene Reedy
  • Method and Apparatus for Reducing Noise on Integrated Circuit using Broken Die Seal
    Publication number: 20200235022
    Abstract: A die seal is broken in at least one place for a conductor strip formed on each conductor layer. Accordingly, no current can flow in a circular pattern around the entire perimeter of the chip. In some embodiments, an angled slot is provided in the original die seal. The angled slots may be vertically aligned. Alternatively, the slots may be vertically staggered or straight. When vertically staggered, the slots on each conductor layer are vertically offset.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 23, 2020
    Inventors: Bryan Lee Hash, Ronald Eugene Reedy