Abstract: Techniques are provided for reducing cross-coupled noise. For example, a method includes coupling an input node to a ground by a primary shunt switch in a closed state, decoupling an output node from the input node by a primary through switch in an open state, switching the primary shunt switch from the closed state to an open state to decouple the input node from the ground, switching the primary through switch from the open state to a closed state to couple the output node to the input node and provide a circuit path for an RF signal from an RF source to a load, and switching an ancillary switch from an open state to a closed state to couple the ancillary switch across one of the primary switches to reduce cross-coupled noise. Additional systems, devices, circuits, and methods are also provided.

Abstract: Techniques are provided for reducing cross-coupled noise. For example, a method includes coupling an input node to a ground by a primary shunt switch in a closed state, decoupling an output node from the input node by a primary through switch in an open state, switching the primary shunt switch from the closed state to an open state to decouple the input node from the ground, switching the primary through switch from the open state to a closed state to couple the output node to the input node and provide a circuit path for an RF signal from an RF source to a load, and switching an ancillary switch from an open state to a closed state to couple the ancillary switch across one of the primary switches to reduce cross-coupled noise. Additional systems, devices, circuits, and methods are also provided.

Abstract: Circuits and methods for increasing the long-term reliability and performance of phase change material (PCM) switches. To overcome the effects of electromigration damage of the resistive heater(s) of a PCM switch and of the PCM itself, and thus improve long-term performance and reliability, embodiments apply an AC control pulse of equal power to a conventional DC control pulse. An embodiment encompasses a PCM switch, including a PCM region including first and second signal ports configured to be coupled to a signal source; a resistive heater adjacent the PCM region and including first and second heater control signal ports; and a source of AC control pulses coupled to the first and second heater control signal ports, the AC control pulses having a first power profile to transform the PCM region into a low resistance state and a second power profile to transform the PCM region into a high resistance state.

Abstract: A die seal is broken in at least one place for a conductor strip formed on each conductor layer. Accordingly, no current can flow in a circular pattern around the entire perimeter of the chip. In some embodiments, an angled slot is provided in the original die seal. The angled slots may be vertically aligned. Alternatively, the slots may be vertically staggered or straight. When vertically staggered, the slots on each conductor layer are vertically offset.

Abstract: A die seal is broken in at least one place for a conductor strip formed on each conductor layer. Accordingly, no current can flow in a circular pattern around the entire perimeter of the chip. In some embodiments, an angled slot is provided in the original die seal. The angled slots may be vertically aligned. Alternatively, the slots may be vertically staggered or straight. When vertically staggered, the slots on each conductor layer are vertically offset.