Patents by Inventor Bryan Lee Sik Pong

Bryan Lee Sik Pong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked packages using laser direct structuring
    Patent number: 9018749
    Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: April 28, 2015
    Assignee: Flextronics AP, LLC
    Inventors: Samuel Tam, Bryan Lee Sik Pong, Dick Pang
  • STACKED PACKAGES USING LASER DIRECT STRUCTURING
    Publication number: 20140110162
    Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.
    Type: Application
    Filed: January 2, 2014
    Publication date: April 24, 2014
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Samuel TAM, Bryan LEE SIK PONG, Dick PANG
  • Method of fabricating stacked packages using laser direct structuring
    Patent number: 8642387
    Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: February 4, 2014
    Assignee: Flextronics AP, LLC
    Inventors: Samuel Tam, Bryan Lee Sik Pong, Dick Pang
  • STACKED PACKAGES USING LASER DIRECT STRUCTURING
    Publication number: 20130105972
    Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.
    Type: Application
    Filed: November 1, 2011
    Publication date: May 2, 2013
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Samuel Tam, Bryan Lee Sik Pong, Dick Pang