Patents by Inventor Bryan LIEB

Bryan LIEB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method
    Patent number: 9809891
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew A. Thorseth, Mark A. Scalisi, Luis A. Gomez, Bryan Lieb, Rebecca Lea Hazebrouck, Mark Lefebvre
  • ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTIILITY COPPER DEPOSITS
    Publication number: 20160312372
    Abstract: Acid copper electroplating baths provide improved low internal stress copper deposits with good ductility. The acid copper electroplating baths include one or more branched polyalkylenimines and one or more accelerators. The acid copper electroplating baths may be used to electroplate thin films on relatively thin substrates to provide thin film copper deposits having low internal stress and high ductility.
    Type: Application
    Filed: April 27, 2015
    Publication date: October 27, 2016
    Inventors: Lingyun WEI, Rebecca HAZEBROUCK, Bryan LIEB, Yu-Hua KAO, Mark LEFEBVRE, Robert A. CORONA
  • PLATING METHOD
    Publication number: 20150376807
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Matthew A. THORSETH, Mark A. SCALISI, Luis A. GOMEZ, Bryan LIEB, Rebecca Lea Hazebrouck, Mark LEFEBVRE