Patents by Inventor Bryan McDonald

Bryan McDonald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12061235
    Abstract: The present disclosure relates to a shared transfer switching system with built in relay testing ability, for transferring power received by a load from a preferred AC power source to an alternate AC power source, or transferring power being received by the load from the alternate AC power source to the preferred AC power source. The system selectively controls various ones of the relays used to apply power from either the preferred or alternate power sources to the load, such that the relays are switched from open to closed states at controlled times, while voltage measurements are made at select locations between the relays. The system can identify which specific ones of a plurality of relays associated with each of the preferred and alternate power sources has properly opened and closed, and thus verify that all of the relays needed to switch between the preferred and alternate power sources are operating properly.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: August 13, 2024
    Assignee: Vertiv Corporation
    Inventors: Scott Cooper, Kevin R. Ferguson, Grant Young, Anthony Bryan McDonald
  • Publication number: 20230119066
    Abstract: This disclosure provides isolated antibodies, for example, monoclonal antibodies, that specifically bind to the C-C Motif Chemokine Receptor 8 (CCR8) expressed on the surface of a cell and mediate depletion of the CCR8-expressing cell by anti-body-dependent cellular cytotoxicity (ADCC). The disclosure provides methods for treating a subject afflicted with a cancer comprising administering to the subject a therapeutically effective amount of an anti-CCR8 antibody as monotherapy or in combination with an anti-cancer agent such as an immune checkpoint inhibitor, for example, an anti-PD-1 or anti-PD-L1 antibody.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 20, 2023
    Inventors: Ruth Yin-Zong Lan, Olufemi A. Adelakun, Ishita Barman, Joseph Campbell, SJ Jian Zhe Diong, Felix Findeisen, Danielle M. Greenawalt, Renu Jain, Amy D. Jhatakia, John K. Lee, Peter S.K. Lee, Linda Liang, Kai Lu, Bryan McDonald, Paul Mesko, Arvind Rajpal, Sharmila Sambanthamoorthy, Mark J. Selby, Nathan O. Siemers, Pavel Strop, Gaby A. Terracina, Xi-Tao Wang
  • Patent number: 9593991
    Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: March 14, 2017
    Assignee: Apple Inc.
    Inventors: Anne M. Mason, Bryan McDonald, Shawn X. Arnold, Matthew Casebolt, Dennis R. Pyper
  • Publication number: 20170030784
    Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.
    Type: Application
    Filed: July 29, 2015
    Publication date: February 2, 2017
    Inventors: Anne M. Mason, Bryan McDonald, Shawn X. Arnold, Matthew Casebolt, Dennis R. Pyper
  • Publication number: 20060243326
    Abstract: A method of plugging a pipeline includes the steps of welding onto the exterior of the pipeline (10) first (12) and second (14) spaced apart collars, each having a sealing face (26,26A) in a plane perpendicular the pipeline (10) axis. A containment housing (34,36) is affixed by welding to the collars (12,14) to fully encompass a section of the pipeline (10) between the collars (12,14). A tapping (60) machine is then removably attached to an open top of the containment housing (34). Using the tapping machine (60) a short length of the pipeline (10) is cut and removed from between the collars (12,14) leaving two open exposed pipe ends (78,80). First and second seal elements (92,94) are positioned between the collars (12,14), Each having a forward sealing face. The seal elements (92,94) are forced apart from each other into sealing engagement with the collar sealing faces thereby closing the open, exposed ends (78,80) of the pipe (10).
    Type: Application
    Filed: April 30, 2004
    Publication date: November 2, 2006
    Inventors: Charles Calkins, Eric Freeman, Tony Garrison, Gary Goins, Philip Morrison, Gregory Puckett, Stephen Jacob, Bryan McDonald, Jack Miller