Abstract: An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.

Abstract: A printhead and methods for forming the printhead are provided. The printhead includes an additively manufactured printhead structure having multiple sintered material layers that correspond to discrete cross-sectional regions of the printhead structure, where each of the sintered material layers is integrally bonded to at least one other sintered material layer. The printhead further includes a polymer layer attached to a surface of the printhead structure, and the printhead structure includes one or more channels for flowing ink through the printhead structure, the one or more channels forming openings on at least one surface of the printhead structure.

Abstract: In some aspects of the present application, a print head and a method of forming the print head are disclosed. The print head can include an array of jets formed in a jet stack; at least one ink reservoir operable to deliver ink to the jet stack; an actuator array arranged on the control circuitry formed into an actuator layer to cause the reservoir to deliver ink in response to signals from the control circuitry; a standoff adhesive layer arranged on the actuator layer, the standoff adhesive layer having an array of holes corresponding to the actuators; and a flex circuit layer having an array of bumped contacts pad corresponding to the array of holes of the standoff adhesive layer.

Abstract: A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.

Abstract: A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.

Abstract: A manifold assembly has been constructed that filters ink before the ink enters an inkjet ejector in an inkjet print head. The manifold assembly includes an adhesive layer having openings, an ink manifold layer having a plurality of openings, the openings in the adhesive layer being aligned with the openings in the ink manifold layer, and a polymer layer having a plurality of filter areas, the filter areas being aligned with the openings in the ink manifold layer and the openings in the adhesive layer, the adhesive layer being interposed between the polymer layer and the ink manifold layer.

Abstract: A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.

Abstract: An aperture plate for a print head of a printer can include a first layer having a first emissivity which is covered by a second layer having a second emissivity which is less than the first emissivity. In an embodiment, the second layer can be etched at nozzle locations to form openings in the second layer which have widths/areas greater than widths/areas of nozzles formed in the first layer. In another embodiment, the second layer can have a smaller thickness at the nozzle locations and a larger thickness away from the nozzle locations. Forming the openings in the second layer which are larger than the nozzles, or forming the second layer thinner at the nozzle locations prior to forming the nozzles, can provide a well-formed nozzle and an aperture plate having a low emissivity.

Abstract: A method for assembling an inkjet jet print head enables piezoelectric transducers to be bonded to an inkjet ejector without closing inlets to a pressure chamber within the inkjet ejector. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive, placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer, and drilling inlets through the thermoset polymer and the diaphragm at the openings in the diaphragm.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing a dielectric fill layer over the diaphragm and the plurality of piezoelectric elements to encapsulate the piezoelectric elements, curing the dielectric fill layer to form an interstitial layer, then removing the interstitial layer from an upper surface of the plurality of piezoelectric elements using a plasma etch.

Abstract: A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.

Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.

Abstract: A method for mounting a piezoelectric transducer layer to a diaphragm layer exposes an electrode for each piezoelectric transducer after thermoset polymer filling the interstitial space between the piezoelectric transducers has been cured. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer, filling areas between the piezoelectric transducers on the diaphragm layer with thermoset polymer, and removing the thermoset polymer from the piezoelectric transducers with a laser to expose a metal electrode on each piezoelectric transducer.

Abstract: A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.

Abstract: A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.

Abstract: A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.

Abstract: A method for assembling an inkjet jet print head enables piezoelectric transducers to be bonded to an inkjet ejector without closing inlets to a pressure chamber within the inkjet ejector. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive, placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer, and drilling inlets through the thermoset polymer and the diaphragm at the openings in the diaphragm.

Abstract: An aperture plate for a print head of a printer can include a first layer having a first emissivity which is covered by a second layer having a second emissivity which is less than the first emissivity. In an embodiment, the second layer can be etched at nozzle locations to form openings in the second layer which have widths/areas greater than widths/areas of nozzles formed in the first layer. In another embodiment, the second layer can have a smaller thickness at the nozzle locations and a larger thickness away from the nozzle locations. Forming the openings in the second layer which are larger than the nozzles, or forming the second layer thinner at the nozzle locations prior to forming the nozzles, can provide a well-formed nozzle and an aperture plate having a low emissivity.