Abstract: A high-density blindmate optoelectronic module is provided. The high-density module is adapted to mount on a removable printed circuit board which is configured to be inserted into a printed circuit board support rack located within a chassis based network element. The high-density module is configured to blindmate with a multi-fiber optical connector mounted within the chassis based network element. The high-density blindmate optoelectronic module is formed of a transceiver mounting block which supports a plurality of connectorized optical sub-assemblies. Each connectorized optical sub-assembly includes a plurality of optical transmitters, optical receivers, or a combination of optical transmitters and optical receivers. The optical transmitters and/or receivers define optical axes that extend through a first side of connectorized optical sub-assemblies.