Patents by Inventor Bryan Timothy Heenan

Bryan Timothy Heenan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7521975
    Abstract: An output driver circuit provides more constant slew rates in the presence of process, voltage, or temperature variations that affect performance. An open ended (no feedback) solution is utilized that provides more constant slew rates in spite of PVT variations. A first performance dependent current and a reference current are generated and a third current is generated that is inversely related to performance utilizing the reference current and the performance dependent current. The third current is supplied to a gate of a first transistor circuit forming a portion of the output driver to thereby control the slew rate.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: April 21, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Randall Paul Biesterfeldt, Bryan Timothy Heenan
  • Patent number: 6614121
    Abstract: A semiconductor stack is provided. The semiconductor stack is comprised of a first semiconductor device, a second semiconductor device, and a socket. The first semiconductor device has a plurality of pins extending therefrom and arranged in a first preselected pattern. The socket is adapted to receive the plurality of pins. The second semiconductor device is disposed between the socket and the first semiconductor device and includes a die, a casing, and a plurality of electrical connections. The casing extends about the die and defines a plurality of openings extending therethrough. The openings are arranged in a first preselected pattern to receive the pins of the first semiconductor device. The plurality of electrical connections are disposed in at least a portion of the plurality of openings. The electrical connections are adapted to electrically communicate with the pins of the first semiconductor device inserted therein and the die.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: September 2, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Bryan Timothy Heenan