Patents by Inventor Bryan Trimm

Bryan Trimm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230187355
    Abstract: A method comprising forming a trench in a substrate and forming a first Ti layer on the top surface of the substrate, such that, the first Ti layer is formed on the exposed surface of the trench. Forming a Nb layer on an exposed top surface of first Ti layer and forming a second Ti layer on the exposed top surface of the Nb layer. Planarizing the second Ti layer, the Nb layer, and the first Ti layer to the top surface of the substrate, wherein the second Ti layer, the Nb layer, and the first Ti layer remain within the trench, wherein the Nb layer has at least two surfaces exposed during the planarizing process.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventors: Santino Carnevale, Wei Kong, Mary Beth Rothwell, Bryan Trimm, Brent Wascaser