Abstract: A nail plater apparatus includes a board magazine configured to hold stacked boards, and a pair of spaced apart nail plate magazines, with each nail plate magazine configured to hold stacked nail plates. The nail plater apparatus includes a pair of spaced apart nail plate extractor assemblies, with each nail plate extractor assembly associated with a respective nail plate magazine and configured to position a nail plate therefrom to a respective nail plate pressing area. A board feeder is configured to position a board from the board magazine to a board receiving area, with ends of the board being aligned with the nail plates positioned in the respective nail plate pressing areas. A pair of spaced apart nail plate presser assemblies overlie ends of the board receiving area and is aligned with the respective nail plate pressing areas to press the nail plates into the ends of the board.

Abstract: Apparatus and method for aligning a rotatable substrate to a support mechanism such as a turntable. The substrate has a circumferentially extending timing pattern comprising at least spaced apart first and second timing marks disposed on opposing sides of a center point of the substrate. The substrate is configured to be mounted to and rotated by the support mechanism about a central axis. The center point of the substrate may be offset from the central axis by an offset distance due to mechanical tolerances associated with the substrate mounting operation. The offset distance may be determined through successive detection of the first and second timing marks by a detector over at least one rotation of the support mechanism and the substrate. A write beam may be adjusted using the determined offset distance to write a second feature to the substrate in alignment with a previously written first feature.