Patents by Inventor Bryant C. Rogers

Bryant C. Rogers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing process for package for electronic devices
    Patent number: 4141712
    Abstract: Semiconductor packages are manufactured according to a method which eliminates or greatly reduces the occurrence of short circuited or otherwise badly positioned leads. The method utilizes a leadframe having a bonding tip support connecting the bonding tips of the leads. After the leadframe is affixed to a ceramic element, the connecting element is removed.
    Type: Grant
    Filed: July 18, 1977
    Date of Patent: February 27, 1979
    Assignee: Diacon Inc.
    Inventor: Bryant C. Rogers