Abstract: Embodiments of the present disclosure generally relate to planarization of surfaces on substrates. More specifically, embodiments of the present disclosure relate to methods and systems for polishing a substrate. In one or more embodiments, the method includes polishing a device side of the substrate in the presence of a first polishing fluid, the first polishing fluid comprising a first ratio of recycled slurry to new slurry; and polishing the device side of the substrate in the presence of a second polishing fluid, the second polishing fluid comprising a second ratio of recycled slurry to new slurry that is smaller than the first ratio of recycled slurry to new slurry.