Abstract: An electronic device includes a housing configured to enclose an electronic component mounted to an inner portion of the housing. A thermally conductive gap-filler is in thermal contact with the electronic component. A heat sink is in thermal contact with the thermally conductive gap-filler and a thermally conductive plate is in thermal contact, at a first side, with the heat sink through an opening in the housing, and affixed, at the first side, to an outer portion of the housing surrounding the opening.

Abstract: A telephone unit has a housing with a stand pivot mount on a bottom side and with an interaction surface at a top side. A single piece stand is provided with a first end connected to the housing via the pivot mount to allow pivoting relative to the housing about the pivot mount through a range of angular positions. The stand also has a second end with surface engagement areas for engagement with a support surface. A latch arrangement is provided for setting the stand in an angular position relative to the housing to set an angular position of the interaction surface relative to the support surface. The latch arrangement is provided as a resilient engagement member at the stand with an engagement surface and a fixing surface at the housing. The resilient engagement member has an engagement surface normal position and is flexible to move the engagement surface out of the normal position.