Patents by Inventor Bu Yeon Hwang

Bu Yeon Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932993
    Abstract: A paper coating composition, methods for making the same, and a coated paper. The paper coating composition comprises a solvent, an ethylene-(meth)acrylic acid copolymer, a basic compound, and a polycarbodiimide-based curing agent, wherein the polycarbodiimide-based curing agent has a carbodiimide group equivalent of about 150 to about 350. The coating of the coated paper likewise comprises an ethylene-(meth)acrylic acid copolymer crosslinked by N-acylurea groups.
    Type: Grant
    Filed: May 26, 2023
    Date of Patent: March 19, 2024
    Assignees: SK Innovation Co., Ltd., SK Geo Centric Co., Ltd.
    Inventors: Dong Hyun Woo, Sang Ha Son, Ji Hyeon Choi, Bu Yeon Hwang