Abstract: A substrate treating apparatus and a substrate treating method are disclosed. The substrate treating apparatus includes a process module configured to perform processing on a substrate, an index module configured to insert the substrate into the process module and withdraw the substrate, of which the processing is completed, from the process module, a loading module configured to relay the substrate between the process module in a vacuum atmosphere and the index module in an atmospheric pressure atmosphere by switching an atmosphere thereof to the vacuum atmosphere or the atmospheric pressure atmosphere, and a control module configured to receive operation states from the process module, the index module, and the loading module and schedule operations of the process module, the index module, and the loading module in a direction in which the number of substrates to be processed per unit time increases with reference to the received operation states.

Abstract: A substrate treating apparatus and a substrate treating method are disclosed. The substrate treating apparatus includes a process module configured to perform processing on a substrate, an index module configured to insert the substrate into the process module and withdraw the substrate, of which the processing is completed, from the process module, a loading module configured to relay the substrate between the process module in a vacuum atmosphere and the index module in an atmospheric pressure atmosphere by switching an atmosphere thereof to the vacuum atmosphere or the atmospheric pressure atmosphere, and a control module configured to receive operation states from the process module, the index module, and the loading module and schedule operations of the process module, the index module, and the loading module in a direction in which the number of substrates to be processed per unit time increases with reference to the received operation states.