Abstract: An apparatus for generating an output signal having a particular frequency includes an oscillator, a first tuning module, and a second tuning module. The oscillator generates an output signal associated with an output frequency. When coupled to the oscillator, the first tuning module is capable of inducing, within a first amount of time, a change in the output frequency of a particular magnitude. When coupled to the oscillator, the second tuning module is capable of inducing, within a second amount of time, a change in the output frequency of the same magnitude. The second amount of time is greater than the first amount of time. The selector couples a selected one of the first tuning module and the second tuning module to the oscillator based on a difference between a frequency-divided version of the output signal and a reference signal.

Abstract: A structure and method of minimizing package-shift effects in integrated circuits is implemented by using a thick metallic overcoat applied after the deposition and patterning of the conventional insulating protective overcoat. The metallic overcoat most preferably comprises a layer of electrolytically deposited copper approximately 15 &mgr;m thick that is patterned to provide for electrically independent regions; but an unbroken area of the metallic overcoat is left over any sensitive analog circuitry, such as a bandgap reference circuit. The thick metallic coating, in addition to minimizing package-shift effects, is also useful as a low-resistance routing layer. The metallic overcoat is sufficiently thin to allow low-profile packaging. The method employs a conductive overcoat that is significantly thin compared to conventional insulating conformal overcoats.

Abstract: A structure and method of minimizing package-shift effects in integrated circuits is implemented by using a thick metallic overcoat applied after the deposition and patterning of the conventional insulating protective overcoat. The metallic overcoat most preferably comprises a layer of electrolytically deposited copper approximately 15 &mgr;m thick that is patterned to provide for electrically independent regions; but an unbroken area of the metallic overcoat is left over any sensitive analog circuitry, such as a bandgap reference circuit. The thick metallic coating, in addition to minimizing package-shift effects, is also useful as a low-resistance routing layer. The metallic overcoat is sufficiently thin to allow low-profile packaging. The method employs a conductive overcoat that is significantly thin compared to conventional insulating conformal overcoats.

Abstract: A structure and method of minimizing package-shift effects in integrated circuits is implemented by using a thick metallic overcoat applied after the deposition and patterning of the conventional insulating protective overcoat. The metallic overcoat most preferably comprises a layer of electrolytically deposited copper approximately 15 &mgr;m thick that is patterned to provide for electrically independent regions; but an unbroken area of the metallic overcoat is left over any sensitive analog circuitry, such as a bandgap reference circuit. The thick metallic coating, in addition to minimizing package-shift effects, is also useful as a low-resistance routing layer. The metallic overcoat is sufficiently thin to allow low-profile packaging. The method employs a conductive overcoat that is significantly thin compared to conventional insulating conformal overcoats.