Patents by Inventor Bugon KIM

Bugon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermo-reversible adhesive composition and thermo-reversible adhesive sheet comprising the same
    Patent number: 10344192
    Abstract: A thermo-reversible adhesive composition containing a base resin, methyl acetoacetate, and a metal-organic complex compound having the formula M(X)n(R)o, wherein: M is a metal selected from the group consisting of aluminum, iron, and nickel, X is acetylacetonate, R is H2O, n is an integer equal to 2 or 3, and o is an integer greater than or equal to 0 and less than or equal to 2, such that n+o is equal to 3 or 4.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: July 9, 2019
    Assignees: Samsung Electronics Co., Ltd., GUARDNEC Co., Ltd.
    Inventors: Yongbeom Kim, Kiho Park, Bowon Jung, Bugon Kim, Jaeik Song, Wonseok Choi
  • THERMO-REVERSIBLE ADHESIVE COMPOSITION AND THERMO-REVERSIBLE ADHESIVE SHEET COMPRISING THE SAME
    Publication number: 20170081556
    Abstract: A thermo-reversible adhesive composition containing a base resin, methyl acetoacetate, and a metal-organic complex compound having the formula M(X)n(R)o, wherein: M is a metal selected from the group consisting of aluminum, iron, and nickel, X is acetylacetonate, R is H2O, n is an integer equal to 2 or 3, and o is an integer greater than or equal to 0 and less than or equal to 2, such that n+o is equal to 3 or 4.
    Type: Application
    Filed: January 28, 2016
    Publication date: March 23, 2017
    Inventors: Yongbeom KIM, Kiho PARK, Bowon JUNG, Bugon KIM, Jaeik SONG, Wonseok CHOI