Patents by Inventor Bui Bao

Bui Bao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8556928
    Abstract: A styptic device (10) for substantially hemostatically sealing a percutaneous puncture (12) in a blood vessel (14) of a patient (11), the styptic device (10) comprising: a base (16); a main compression element (18) extending from the base (16), the main compression element (18) defining a main compression surface (24) compressible against the patient (11); and an auxiliary compression element (20) removably attachable to the base (16), the auxiliary compression element (20) defining an auxiliary compression surface (26) compressible against the patient (11).
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: October 15, 2013
    Assignee: Benrikal Services Inc.
    Inventors: Bui Bao, Richard Gendron, Olivier Bertrand
  • Publication number: 20110295310
    Abstract: A styptic device (10) for substantially hemostatically sealing a percutaneous puncture (12) in a blood vessel (14) of a patient (11), the styptic device (10) comprising: a base (16); a main compression element (18) extending from the base (16), the main compression element (18) defining a main compression surface (24) compressible against the patient (11); and an auxiliary compression element (20) removably attachable to the base (16), the auxiliary compression element (20) defining an auxiliary compression surface (26) compressible against the patient (11).
    Type: Application
    Filed: December 17, 2009
    Publication date: December 1, 2011
    Inventors: Bui Bao, Richard Gendron, Olivier Bertrand