Patents by Inventor Bum Chul Cho
Bum Chul Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9646956Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.Type: GrantFiled: May 14, 2015Date of Patent: May 9, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Bum Chul Cho, Moon Sub Kim, Jin Kwan Kim
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Patent number: 9287466Abstract: A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.Type: GrantFiled: November 22, 2013Date of Patent: March 15, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Bum Chul Cho, Jin Soo Park
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Publication number: 20150249074Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.Type: ApplicationFiled: May 14, 2015Publication date: September 3, 2015Applicant: LG INNOTEK CO., LTD.Inventors: Bum Chul CHO, Moon Sub KIM, Jin Kwan KIM
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Patent number: 9064773Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.Type: GrantFiled: March 15, 2013Date of Patent: June 23, 2015Assignee: LG INNOTEK CO., LTD.Inventors: Bum Chul Cho, Moon Sub Kim, Jin Kwan Kim
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Patent number: 8987920Abstract: A wafer substrate bonding structure may be provided that includes: a first substrate; and a conductive thin film which is disposed on the first substrate and includes a resin and conductive corpuscles included in the resin.Type: GrantFiled: December 6, 2011Date of Patent: March 24, 2015Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Patent number: 8907551Abstract: A light emitting device package including a substrate; a light emitting device on the substrate; a first heatsink between the substrate and the light emitting device to transfer heat generated from the light emitting device; a second heatsink disposed below the first heatsink; and an electrode between the first heat sink and the light emitting device. Further, the substrate is disposed between the first and second heatsinks and is narrower at a position between the first and second heatsinks than at a position not between the first and second heatsinks, a material of the substrate is the same at the position between the first and second heatsinks as not between the first and second heatsinks, and the substrate at the position not between the first and second heatsinks surrounds the first and second heat sinks.Type: GrantFiled: October 1, 2013Date of Patent: December 9, 2014Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Patent number: 8829538Abstract: Provided is a light emitting device package. The light emitting device package comprises a body formed of a silicon-based material; an insulating layer having a first opening on a surface of the body; a first and second metal layers disposed on the insulating layer; a light emitting device having a plurality of compound semiconductor layers disposed on a top surface of the body and connected to the first and second metal layers; and a protection device disposed on the body and electrically connected to the light emitting device, wherein the insulating layer has a second opening on a bottom surface of the body, wherein a first portion of the first metal layer is connected to the protective device and is disposed in the second opening of the insulating layer.Type: GrantFiled: March 11, 2013Date of Patent: September 9, 2014Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Publication number: 20140117357Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.Type: ApplicationFiled: March 15, 2013Publication date: May 1, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Bum Chul CHO, Moon Sub KIM, Jin Kwan KIM
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Patent number: 8680552Abstract: A light emitting device package of the embodiment includes a body; an insulating layer on a surface of the body; at least one electrode layer on the insulating layer; and a light emitting device on the at least one electrode layer. The electrode layer includes a thermal diffusion layer and a reflective layer on the thermal diffusion layer, and the thermal diffusion layer has a thickness thicker than a thickness of the reflective layer by at least twenty times.Type: GrantFiled: April 27, 2011Date of Patent: March 25, 2014Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Publication number: 20140077249Abstract: A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.Type: ApplicationFiled: November 22, 2013Publication date: March 20, 2014Applicant: LG INNOTEK CO., LTDInventors: Bum Chul CHO, Jin Soo PARK
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Publication number: 20140055981Abstract: A light emitting device package including a substrate; a light emitting device on the substrate; a first heatsink between the substrate and the light emitting device to transfer heat generated from the light emitting device; a second heatsink disposed below the first heatsink; and an electrode between the first heat sink and the light emitting device. Further, the substrate is disposed between the first and second heatsinks and is narrower at a position between the first and second heatsinks than at a position not between the first and second heatsinks, a material of the substrate is the same at the position between the first and second heatsinks as not between the first and second heatsinks, and the substrate at the position not between the first and second heatsinks surrounds the first and second heat sinks.Type: ApplicationFiled: October 1, 2013Publication date: February 27, 2014Applicant: LG INNOTEK CO., LTD.Inventor: Bum Chul CHO
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Patent number: 8624268Abstract: A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.Type: GrantFiled: July 23, 2008Date of Patent: January 7, 2014Assignee: LG Innotek Co., Ltd.Inventors: Bum Chul Cho, Jin Soo Park
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Patent number: 8569770Abstract: A light emitting device package including a substrate; a light emitting device on the substrate; a first heatsink between the substrate and the light emitting device to transfer heat generated from the light emitting device; a second heatsink disposed below the first heatsink; and an electrode between the first heat sink and the light emitting device. Further, the substrate is disposed between the first and second heatsinks and is narrower at a position between the first and second heatsinks than at a position not between the first and second heatsinks, a material of the substrate is the same at the position between the first and second heatsinks as not between the first and second heatsinks, and the substrate at the position not between the first and second heatsinks surrounds the first and second heat sinks.Type: GrantFiled: December 19, 2012Date of Patent: October 29, 2013Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Patent number: 8410513Abstract: Provided is a light emitting device package. The light emitting device package comprises a first conductive type package body, an insulating layer comprising an opening on the package body, a plurality of compound semiconductor layers disposed on the package body through the opening of the insulating layer, an electrode electrically connected to the plurality of compound semiconductor layers, a first metal layer electrically connected to the package body and disposed on a part of the insulating layer, and a second metal layer electrically connected to the electrode and disposed on the other part of the insulating layer.Type: GrantFiled: February 16, 2010Date of Patent: April 2, 2013Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Patent number: 8395181Abstract: A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.Type: GrantFiled: September 21, 2011Date of Patent: March 12, 2013Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Patent number: 8358054Abstract: Provided is a light emitting device package. The light emitting device package comprises a substrate, a light emitting device on the substrate, a first heatsink between the substrate and the light emitting device, the first heatsink being at least partially disposed within the substrate to transfer heat generated from the light emitting device, first and second electrodes electrically separated from each other, the first and second electrodes being electrically connected to the light emitting device.Type: GrantFiled: February 22, 2010Date of Patent: January 22, 2013Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Patent number: 8294176Abstract: A light emitting apparatus includes: a substrate including a first conductive type impurity; a first heatsink and a second heatsink on a first region and a second region of the substrate; second conductive type impurity regions on the substrate and electrically connected to the first heatsink and the second heatsink, respectively; a first electrode electrically connected to the first heatsink on the substrate; a second electrode electrically connected to the second heatsink on the substrate; and a light emitting device electrically connected to the first electrode and the second electrode on the substrate.Type: GrantFiled: September 16, 2011Date of Patent: October 23, 2012Assignee: LG Innotek Co., Ltd.Inventor: Bum Chul Cho
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Publication number: 20120153329Abstract: A wafer substrate bonding structure may be provided that includes: a first substrate; and a conductive thin film which is disposed on the first substrate and includes a resin and conductive corpuscles included in the resin.Type: ApplicationFiled: December 6, 2011Publication date: June 21, 2012Inventor: Bum Chul Cho
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Patent number: 8203163Abstract: Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.Type: GrantFiled: September 5, 2008Date of Patent: June 19, 2012Assignee: LG Innotek Co., Ltd.Inventors: Bum Chul Cho, Geun Ho Kim, Sung Jin Son, Jin Soo Park
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Publication number: 20120068203Abstract: A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.Type: ApplicationFiled: September 21, 2011Publication date: March 22, 2012Inventor: Bum Chul Cho