Patents by Inventor Bum Dol Kim

Bum Dol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip package and operating method thereof
    Patent number: 8565027
    Abstract: A multi-chip package includes a voltage generating circuit configured to generate a power source voltage and a plurality of memory chips coupled to the voltage generating circuit to each receive the power source voltage, wherein the memory chips are each configured to postpone an operation if the power source voltage is lower than a target voltage and perform the operation when the power source voltage reaches the target voltage.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: October 22, 2013
    Assignee: Hynix Semiconductor Inc.
    Inventors: Bum Dol Kim, You Sung Kim
  • MULTI-CHIP PACKAGE AND OPERATING METHOD THEREOF
    Publication number: 20120140579
    Abstract: A multi-chip package includes a voltage generating circuit configured to generate a power source voltage and a plurality of memory chips coupled to the voltage generating circuit to each receive the power source voltage, wherein the memory chips are each configured to postpone an operation if the power source voltage is lower than a target voltage and perform the operation when the power source voltage reaches the target voltage.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 7, 2012
    Inventors: Bum Dol Kim, You Sung Kim