Patents by Inventor Bum Joon Jin

Bum Joon Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7678592
    Abstract: In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: March 16, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seon Goo Lee, Bum Joon Jin, Kyung Taeg Han, Chang Wook Kim
  • Publication number: 20070145387
    Abstract: The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.
    Type: Application
    Filed: March 1, 2007
    Publication date: June 28, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Goo LEE, Bum Joon JIN, Kyung Taeg HAN, Chang Wook KIM