Patents by Inventor Bum Seung LIM

Bum Seung LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411669
    Abstract: An apparatus for manufacturing an electrode cell is configured to manufacture the electrode cell by stacking and cutting a separator sheet and an electrode sheet. A method for controlling an apparatus for manufacturing an electrode cell includes: a first detection process of inspecting the electrode cell in real time or at a preset period while a process of manufacturing the electrode cell is performed; a second detection process of detecting an alignment of the electrode sheet and the separator sheet; and an output process of outputting information of a position at which abnormality of the alignment is detected in the second detection process when abnormality of the electrode cell is detected in the first detection process.
    Type: Application
    Filed: January 4, 2022
    Publication date: December 21, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Bum Seung Lim, Inn Whan Cho
  • Publication number: 20220072632
    Abstract: A cutting apparatus and a method for chamfering a film stack using the cutting apparatus. The chamfering method reduces microcracks generated in the film stack during curved surface chamfering, reduces the maximum stress applied to the film stack, prevents lifting, and enables processing of a curved surface.
    Type: Application
    Filed: March 5, 2019
    Publication date: March 10, 2022
    Inventors: Young Tae KIM, Seul Ki PARK, Bum Seung LIM, Do Weon YANG, Yu Shik HONG
  • Publication number: 20220001463
    Abstract: Provided are a hole machining apparatus for an optical film, comprising: a clamping part for fixing a plurality of optical films in stacked laminated state; and a machining part for performing a hole operation on a predetermined region of the plurality of optical films so as to sequentially pass through the optical films along the laminated direction in a state where the optical films are fixed to the clamping part, wherein upon the hole operation, the machining part comprises a drill part provided to perform a primary hole machining operation and a bite unit provided to perform a secondary hole operation in the primary hole operation region. Also provided is a hole machining method for an optical film, comprising clamping a plurality of laminated optical films at a predetermined pressure in the hole machining apparatus.
    Type: Application
    Filed: October 21, 2019
    Publication date: January 6, 2022
    Inventors: Seong Yong WE, Sung Wook HWANG, Bum Seung LIM, Byeong Chan CHOI, Seul Ki PARK, Ye Jin MUN, Woo Yong SONG, Zi Shuo ZHANG