Patents by Inventor Bum-Sung Kim
Bum-Sung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240097061Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type at an interval on the rear surface of the semiconductor substrate. Furthermore, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.Type: ApplicationFiled: November 7, 2023Publication date: March 21, 2024Inventors: Hwa Nyeon Kim, Ju Hwan Yun, Jong Hwan Kim, Bum Sung Kim, II Hyoung Jung, Jin Ah Kim
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Patent number: 11843063Abstract: The present invention discloses a back contact solar cell comprising: a first conductive type semiconductor substrate having a front surface and a rear surface of a texturing structure; an oxide layer formed on the front surface of the substrate; at least one first conductive type semiconductor region and second conductive type semiconductor region alternatively formed at predetermined intervals on the rear surface of the substrate; an oxide layer formed on the remaining rear surface of the substrate except for the first conductive type semiconductor region and the second conductive type semiconductor region; and electrodes formed on each of the first conductive type semiconductor region and the second conductive type semiconductor region.Type: GrantFiled: November 13, 2008Date of Patent: December 12, 2023Assignee: Shangrao Jinko solar Technology Development Co., LTDInventors: Hwa Nyeon Kim, Ju Hwan Yun, Jong Hwan Kim, Bum Sung Kim, Il Hyoung Jung, Jin Ah Kim
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Publication number: 20160111565Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type at an interval on the rear surface of the semiconductor substrate. Furthermore, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.Type: ApplicationFiled: December 29, 2015Publication date: April 21, 2016Applicant: LG ELECTRONICS INC.Inventors: Hwa Nyeon KIM, Ju Hwan YUN, Jong Hwan KIM, Bum Sung KIM, II Hyoung JUNG, Jin Ah KIM
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Publication number: 20150380575Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; and a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type, the first conductive type semiconductor region and the second conductive type semiconductor region being disposed with an interval on the rear surface of the semiconductor substrate. In addition, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.Type: ApplicationFiled: September 1, 2015Publication date: December 31, 2015Applicant: LG ELECTRONICS INC.Inventors: Hwa Nyeon KIM, Ju Hwan YUN, Jong Hwan KIM, Bum Sung KIM, Il Hyoung JUNG, Jin Ah KIM
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Publication number: 20120135558Abstract: With the present invention, two wafers for a solar cell only whose light receiving surfaces are selectively etched can be simultaneously obtained by overlapping the two wafers and performing a single-sided etching or an asymmetric etching thereon. The present invention provides a method of etching a wafer comprising: performing a single-sided etching or an asymmetric etching on the wafer, wherein the performing the single-sided etching or the asymmetric etching comprises: overlapping two wafers whose one sides face each other; and etching the overlapped two wafers, and a solar cell including the etched wafers.Type: ApplicationFiled: February 7, 2012Publication date: May 31, 2012Inventors: Jong-Dae KIM, Bum-Sung KIM, Ju-Hwan YUN, Young-Hyun LEE
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Publication number: 20120000517Abstract: The present invention relates to a solar cell and a method for manufacturing the same. More specifically, the present invention provides a silicon solar cell capable of minimizing defects and recombination of electrons-holes by removing a damaged layer formed by a laser edge isolation process to isolate a silicon substrate and covering a protective layer on a surface thereof and a method for manufacturing the same.Type: ApplicationFiled: September 13, 2011Publication date: January 5, 2012Inventors: Ju-Hwan YUN, Jong-Hwan KIM, Bum-Sung KIM, Ji-Hoon KO
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Publication number: 20120003781Abstract: The present invention relates to a solar cell and a method for manufacturing the same. More specifically, the present invention provides a silicon solar cell capable of minimizing defects and recombination of electrons-holes by removing a damaged layer formed by a laser edge isolation process to isolate a silicon substrate and covering a protective layer on a surface thereof and a method for manufacturing the same.Type: ApplicationFiled: September 13, 2011Publication date: January 5, 2012Inventors: Ju-Hwan YUN, Jong-Hwan KIM, Bum-Sung KIM, Ji-Hoon KO
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Publication number: 20110100457Abstract: The present invention discloses a back contact solar cell comprising: a first conductive type semiconductor substrate having a front surface and a rear surface of a texturing structure; an oxide layer formed on the front surface of the substrate; at least one first conductive type semiconductor region and second conductive type semiconductor region alternatively formed at predetermined intervals on the rear surface of the substrate; an oxide layer formed on the remaining rear surface of the substrate except for the first conductive type semiconductor region and the second conductive type semiconductor region; and electrodes formed on each of the first conductive type semiconductor region and the second conductive type semiconductor region.Type: ApplicationFiled: November 13, 2008Publication date: May 5, 2011Applicant: LG ELECTRONICS INC.Inventors: Hwa Nyeon Kim, Ju Hwan Yun, Jong Hwan Kim, Bum Sung Kim, Ii Hyoung Jung, Jin Ah Kim
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Publication number: 20100006135Abstract: A photovoltaic device module and a fabrication method thereof are disclosed. There are provided a solar cell module structure effective to prevent the performance of the overall module from being degraded when photoelectric conversion efficiency of a specific portion cell is degraded in a solar cell module in which solar cells are integrated, and a fabrication method thereof. More particularly, there are provided a module structure having two terminal wirings, in which one of them is formed by selecting and connecting at least two unit cells from a plurality of unit cells electrically connected and the other is formed by selecting and connecting at least two unit cells differentiated from the said selected unit cells., and a fabrication method thereof.Type: ApplicationFiled: January 9, 2008Publication date: January 14, 2010Inventors: Bum-Sung Kim, Seh-Won Ahn, Young-Joo Eo, Heon-Min Lee
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Publication number: 20090260681Abstract: The present invention relates to a solar cell and a method for manufacturing the same. More specifically, the present invention provides a silicon solar cell capable of minimizing defects and recombination of electrons-holes by removing a damaged layer formed by a laser edge isolation process to isolate a silicon substrate and covering a protective layer on a surface thereof and a method for manufacturing the same.Type: ApplicationFiled: February 24, 2009Publication date: October 22, 2009Applicant: LG Electronics Inc.Inventors: Ju-Hwan YUN, Jong-Hwan Kim, Bum-Sung Kim, Ji-Hoon Ko
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Publication number: 20090223561Abstract: With the present invention, two wafers for a solar cell only whose light receiving surfaces are selectively etched can be simultaneously obtained by overlapping the two wafers and performing a single-sided etching or an asymmetric etching thereon. The present invention provides a method of etching a wafer comprising: performing a single-sided etching or an asymmetric etching on the wafer, wherein the performing the single-sided etching or the asymmetric etching comprises: overlapping two wafers whose one sides face each other; and etching the overlapped two wafers, and a solar cell including the etched wafers.Type: ApplicationFiled: February 19, 2009Publication date: September 10, 2009Applicant: LG Electronics Inc.Inventors: Jong-Dae KIM, Bum-Sung Kim, Ju-Hwan Yun, Young-Hyun Lee
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Publication number: 20090217966Abstract: The present invention relates to a photovoltaic conversion apparatus including a by-pass diode and a manufacturing method thereof. The photovoltaic conversion apparatus of the present invention comprises at least one unit solar cell module configured of at least one unit solar cell; and a by-pass solar cell module including at least one solar cell electrically connected to the unit solar cell to by-pass current. According to the present invention, a photovoltaic conversion apparatus having high photoelectric conversion efficiency can be manufactured. Also, the photovoltaic conversion apparatus will contribute to earths environmental conservation as the next clean energy source and can be directly applied to private facilities, public facilities, military facilities, etc., to create enormous economic value.Type: ApplicationFiled: September 3, 2007Publication date: September 3, 2009Applicant: LG Electronics Inc.Inventors: Young-Joo Eo, Hwa-Nyeon Kim, Seh-Won Ahn, Hae-Seok Lee, Heon-Min Lee, Jung-Heum Yun, Kwang-Sun Ji, Bum-Sung Kim
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Publication number: 20090178710Abstract: The present invention discloses a thin-film type solar cell including another upper transparent conductive layer between a silicon semiconductor layer and an upper transparent conductive layer, and a manufacturing method thereof. At this time, the silicon based semiconductor layer used may be formed of at least one amorphous silicon based (p/i/n) thin film or may be formed as a tandem type silicon based semiconductor layer formed of the amorphous silicon based (p/i/n) thin film, an intermediate transparent conductive layer, and a microcrystalline silicon based thin film.Type: ApplicationFiled: January 8, 2009Publication date: July 16, 2009Applicant: LG ELECTRONICS INC.Inventors: Young-Joo Eo, Bum-Sung Kim, Heon-Min Lee, Hae-Seok Lee, Seh-Won Ahn
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Publication number: 20080245415Abstract: A photoelectric conversion device includes at least one p-type semiconductor layer made of amorphous like hydrogenated carbon film or diamond like carbon (DLC) film doped with acceptor impurities such as boron (B). In a solar cell having a photoelectric conversion region, hydrogenated carbon is used as substances forming a p-type semiconductor layer, making it possible to provide a solar cell with high photoelectric conversion efficiency.Type: ApplicationFiled: April 4, 2008Publication date: October 9, 2008Inventors: Hwa Nyeon Kim, Bum Sung Kim, Hae Seok Lee, Jung Heum Yun, Heon Min Lee