Patents by Inventor BumGeun PARK

BumGeun PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming redistribution layer using photo-sintering
    Patent number: 11229124
    Abstract: The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: January 18, 2022
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: SeungBoo Jung, KwangHo Jung, WooRam Myung, HakSan Jeong, BumGeun Park, ChoongJae Lee, KyungDeuk Min
  • METHOD FOR FORMING REDISTRIBUTION LAYER USING PHOTO-SINTERING
    Publication number: 20190335590
    Abstract: The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 31, 2019
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: SeungBoo JUNG, KwangHo JUNG, WooRam MYUNG, HakSan JEONG, BumGeun PARK, ChoongJae LEE, KyungDeuk MIN