Patents by Inventor Bum Jin Cho
Bum Jin Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11056767Abstract: An electronic device includes a first antenna configured to transmit and receive a first signal of a first frequency band, and a housing in which the first antenna is accommodated, wherein the housing includes a first conductor having a first slit that at least partially overlaps the first antenna, wherein the first conductor is formed of a metal and at least a portion of the first slit is filled with a metal oxide. Additionally, the electronic device includes a second conductor configured to transmit and receive a second signal of a second frequency band, and a second slit formed between the first conductor and the second conductor, and wherein the second slit is filled with a material that has an external appearance that is different from that of the second conductor.Type: GrantFiled: April 18, 2018Date of Patent: July 6, 2021Inventors: Sung Chul Park, Kyi Hyun Jang, Bum Jin Cho, Kyung Kyun Kang, Ji Ho Kim, Gyu Bok Park, Kyung Moon Seol, Hyun Jeong Lee
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Patent number: 10886600Abstract: An electronic device includes a housing including a back cover and a cover glass facing away from the back cover, a coil type radiator disposed between the back cover and the cover glass, at least one printed circuit board (PCB) disposed between the radiator and the cover glass, a communication circuit disposed on the PCB and feeding to the radiator, a first connecting member, a second connecting member, and one or more elements.Type: GrantFiled: June 11, 2018Date of Patent: January 5, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Bum Jin Cho, Jae Bong Chun
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Publication number: 20180358687Abstract: An electronic device includes a housing including a back cover and a cover glass facing away from the back cover, a coil type radiator disposed between the back cover and the cover glass, at least one printed circuit board (PCB) disposed between the radiator and the cover glass, a communication circuit disposed on the PCB and feeding to the radiator, a first connecting member, a second connecting member, and one or more elements.Type: ApplicationFiled: June 11, 2018Publication date: December 13, 2018Inventors: Bum Jin CHO, Jae Bong CHUN
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Publication number: 20180301792Abstract: An electronic device includes a first antenna configured to transmit and receive a first signal of a first frequency band, and a housing in which the first antenna is accommodated, wherein the housing includes a first conductor having a first slit that at least partially overlaps the first antenna, wherein the first conductor is formed of a metal and at least a portion of the first slit is filled with a metal oxide. Additionally, the electronic device includes a second conductor configured to transmit and receive a second signal of a second frequency band, and a second slit formed between the first conductor and the second conductor, and wherein the second slit is filled with a material that has an external appearance that is different from that of the second conductor.Type: ApplicationFiled: April 18, 2018Publication date: October 18, 2018Inventors: Sung Chul PARK, Kyi Hyun Jang, Bum Jin Cho, Kyung Kyun Kang, Ji Ho Kim, Gyu Bok Park, Kyung Moon Seol, Hyun Jeong Lee
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Patent number: 9711864Abstract: An antenna device of a mobile terminal having improved performance by utilizing a metal object located in proximity to the antenna device as an antenna radiator is provided. The antenna device includes an antenna pattern connected to a feeder and a ground line, and a metal component positioned on the antenna pattern and including a metal that forms an antenna radiator.Type: GrantFiled: January 23, 2015Date of Patent: July 18, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Young Boo Vin, Dong Hyun Lee, Soon Ho Hwang, Hae Yeon Kim, Bum Jin Cho, Se Hyun Park, Joon Ho Byun
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Publication number: 20150130670Abstract: An antenna device of a mobile terminal having improved performance by utilizing a metal object located in proximity to the antenna device as an antenna radiator is provided. The antenna device includes an antenna pattern connected to a feeder and a ground line, and a metal component positioned on the antenna pattern and including a metal that forms an antenna radiator.Type: ApplicationFiled: January 23, 2015Publication date: May 14, 2015Inventors: Young Boo VIN, Dong Hyun LEE, Soon Ho HWANG, Hae Yeon KIM, Bum Jin CHO, Se Hyun PARK, Joon Ho BYUN
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Patent number: 8963783Abstract: An antenna device of a mobile terminal having improved performance by utilizing a metal object located in proximity to the antenna device as an antenna radiator is provided. The antenna device includes an antenna pattern connected to a feeder and a ground line, and a metal component positioned on the antenna pattern and including a metal that forms an antenna radiator.Type: GrantFiled: January 5, 2012Date of Patent: February 24, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Young Boo Vin, Dong Hyun Lee, Soon Ho Hwang, Hae Yeon Kim, Bum Jin Cho, Se Hyun Park, Joon Ho Byun
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Publication number: 20130050026Abstract: An antenna device of a mobile terminal having improved performance by utilizing a metal object located in proximity to the antenna device as an antenna radiator is provided. The antenna device includes an antenna pattern connected to a feeder and a ground line, and a metal component positioned on the antenna pattern and including a metal that forms an antenna radiator.Type: ApplicationFiled: January 5, 2012Publication date: February 28, 2013Applicant: SAMSUNG ELECTRONICS CO. LTD.Inventors: Young Boo VIN, Dong Hyun LEE, Soon Ho HWANG, Hae Yeon KIM, Bum Jin CHO, Se Hyun PARK, Joon Ho BYUN
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Patent number: 8203490Abstract: A multi-band antenna apparatus using a multiple frequency band is provided. The apparatus includes a substrate body formed in a flat plate structure having a preset thickness and in which at least one dielectric plate is stacked, a power supply line, disposed at the substrate body and connected to an external power source, for forming an electromagnetic field when power is supplied from the external power source, a radiation line, separated from the power supply line using the dielectric plate as the boundary in the substrate body, for forming an overlapping area overlapped with the power supply line along one axis through at least a portion, and for resonating in a frequency band determined according to the overlapping area when the electromagnetic field is formed, and a ground plate disposed in at least one an upper ground area and a lower ground area of the substrate body, for grounding the radiation line by contacting with the radiation line.Type: GrantFiled: April 7, 2010Date of Patent: June 19, 2012Assignee: Samsung Electronics Co., LtdInventors: Yong Soo Kwak, Bum Jin Cho, Joon Ho Byun, Seong Tae Jeong, Austin Kim, Sung Koo Park
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Publication number: 20100265152Abstract: A multi-band antenna apparatus using a multiple frequency band is provided. The apparatus includes a substrate body formed in a flat plate structure having a preset thickness and in which at least one dielectric plate is stacked, a power supply line, disposed at the substrate body and connected to an external power source, for forming an electromagnetic field when power is supplied from the external power source, a radiation line, separated from the power supply line using the dielectric plate as the boundary in the substrate body, for forming an overlapping area overlapped with the power supply line along one axis through at least a portion, and for resonating in a frequency band determined according to the overlapping area when the electromagnetic field is formed, and a ground plate disposed in at least one an upper ground area and a lower ground area of the substrate body, for grounding the radiation line by contacting with the radiation line.Type: ApplicationFiled: April 7, 2010Publication date: October 21, 2010Applicant: Samsung Electronics Co. Ltd.Inventors: Yong Soo KWAK, Bum Jin CHO, Joon Ho BYUN, Seong Tae JEONG, Austin KIM, Sung Koo PARK