Patents by Inventor Bum-su Kim

Bum-su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171547
    Abstract: An apparatus for controlling and blocking user access using a web application proxy includes: a web server system; and a web application proxy installed in the web server system and configured to determine whether to provide the user with a web service by confirming access authority of a user using an external network, wherein the web application proxy includes: a packet processing module configured to collect and analyze request packets; a service control module configured to control the user access to the web service by extracting identification information of the user from the packets to confirm whether the user of the extracted identification information has the access authority to the web service; and an external policy management module configured to collect and manage an updated access control policy of the user and an updated policy for the web service by communicating with an external integrated policy management server.
    Type: Application
    Filed: June 19, 2023
    Publication date: May 23, 2024
    Inventors: Ki Uk LEE, Ju Young PARK, Bum Su KIM, Jeong Hoon YOON
  • Patent number: 11945864
    Abstract: A monoclonal antibody or an antigen-binding fragment thereof according to an embodiment of the present invention can bind to lymphocyte-activation gene 3 (LAG-3) including a heavy chain variable region and a light chain variable region and inhibit the activity thereof. Thus it is expected to be useful for the development of immunotherapeutic agents for various disorders that are associated with LAG-3.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 2, 2024
    Assignee: Y-BIOLOGICS INC.
    Inventors: Sang Pil Lee, Ji-Young Shin, Sunha Yoon, Yunseon Choi, Jae Eun Park, Ji Su Lee, Youngja Song, Gisun Baek, Seok Ho Yoo, Yeung-chul Kim, Dong Jung Lee, Bum-Chan Park, Young Woo Park
  • Patent number: 11682526
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: June 20, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
  • Publication number: 20210335546
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Application
    Filed: July 8, 2021
    Publication date: October 28, 2021
    Inventors: Hye Min BANG, Bum Su KIM, Hyun Hee GU, Hee Sang KANG
  • Patent number: 11069481
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: July 20, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
  • Patent number: 10978250
    Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Yeol Choi, Hyun Hee Gu, Bum Su Kim
  • Publication number: 20200066451
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Application
    Filed: October 31, 2019
    Publication date: February 27, 2020
    Inventors: Hye Min BANG, Bum Su KIM, Hyun Hee GU, Hee Sang KANG
  • Patent number: 10573460
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: February 25, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
  • Patent number: 10559428
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Yeol Choi, Hyun Hee Gu, Bum Su Kim
  • Publication number: 20190385797
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Application
    Filed: November 5, 2018
    Publication date: December 19, 2019
    Inventors: Hye Min BANG, Bum Su KIM, Hyun Hee GU, Hee Sang KANG
  • Publication number: 20190180941
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 13, 2019
    Inventors: Hye Young CHOI, Jae Yeol CHOI, Hyun Hee GU, Bum Su KIM
  • Patent number: 10062506
    Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Yeol Choi, Hyun Hee Gu, Bum Su Kim
  • Publication number: 20180226192
    Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.
    Type: Application
    Filed: April 3, 2018
    Publication date: August 9, 2018
    Inventors: Hye Young CHOI, Jae Yeol CHOI, Hyun Hee GU, Bum Su KIM
  • Patent number: 9978428
    Abstract: In a semiconductor device, some regions of a memory cell array region may be used as reservoir regions. A semiconductor device may include at least one reservoir cell disposed with the memory cells in a cell array region.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: May 22, 2018
    Assignee: SK hynix Inc.
    Inventor: Bum Su Kim
  • Publication number: 20180068692
    Abstract: In a semiconductor device, some regions of a memory cell array region may be used as reservoir regions. A semiconductor device may include at least one reservoir cell disposed with the memory cells in a cell array region.
    Type: Application
    Filed: April 12, 2017
    Publication date: March 8, 2018
    Applicant: SK hynix Inc.
    Inventor: Bum Su KIM
  • Patent number: 9847288
    Abstract: A semiconductor device includes a signal transmission line extending in a first direction; an outer protective line extending in a substantially identical direction as the first direction and spaced apart from the signal transmission line by a predetermined distance along a second direction which is substantially perpendicular to the first direction; and an inner protective line, disposed between the outer protective line and the signal transmission line, and intermittently extending substantially in parallel with said signal transmission line and outer protective line.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: December 19, 2017
    Assignee: SK Hynix Inc.
    Inventors: Young Hee Yoon, Bum Su Kim, Yung Bog Yoon
  • Publication number: 20170287640
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
    Type: Application
    Filed: January 4, 2017
    Publication date: October 5, 2017
    Inventors: Hye Young CHOI, Jae Yeol CHOI, Hyun Hee GU, Bum Su KIM
  • Publication number: 20170278631
    Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.
    Type: Application
    Filed: October 18, 2016
    Publication date: September 28, 2017
    Inventors: Hye Young CHOI, Jae Yeol CHOI, Hyun Hee GU, Bum Su KIM
  • Patent number: 9767871
    Abstract: A sense amplifier of a semiconductor device is disclosed. The sense amplifier of a semiconductor device may include a PMOS latch transistor and an NMOS latch transistor formed in a cross-coupled latch type, and may be configured to sense and amplify a signal of a pair of bit lines. The sense amplifier of a semiconductor device may include a Yi transistor configured to output a data signal amplified by the PMOS latch transistor and the NMOS latch transistor according to a column control signal, and may share a well region with the PMOS latch transistor.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: September 19, 2017
    Assignee: SK hynix Inc.
    Inventor: Bum Su Kim
  • Patent number: D1025970
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon-Young Kim, Yun-Su Cho, Hyun-Keun Son, Bum-Soo Park