Patents by Inventor Bum-Woo Lee
Bum-Woo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990279Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.Type: GrantFiled: March 23, 2022Date of Patent: May 21, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Woo Yoon, Su Jin Lee, Da Mi Kim, Bum Suk Kang, Seong Han Park, Jeong Ryeol Kim
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Publication number: 20240161976Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.Type: ApplicationFiled: March 14, 2023Publication date: May 16, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Woo YOON, Bum Suk KANG, Da Mi KIM, Su Jin LEE
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Publication number: 20240164207Abstract: An organic electric element according to an embodiment of the present disclosure includes a first electrode, a second electrode, and an organic material layer formed between the first electrode and the second electrode. The organic material layer may include a plurality of light-emitting auxiliary layers and the LUMO/HOMO energy levels of the plurality of light-emitting auxiliary layers are limited to specific conditions in relation to the neighboring organic material layers, thereby the driving voltage, the luminous efficiency and the lifetime of the organic electric element can be improved.Type: ApplicationFiled: September 4, 2020Publication date: May 16, 2024Inventors: Bum Sung LEE, Min Ji JO, Soung Yun MUN, Sun Hee LEE, Je Woo LEE, Young Hoon KANG
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Publication number: 20240155134Abstract: A method and an apparatus are disclosed for video coding using improved cross-component linear model (CCLM) prediction. The video coding method and the apparatus generate a first predictor of a current chroma block according to CCLM prediction, and additionally generate a second predictor of the current chroma block based on the neighboring pixels of the current chroma block in intra prediction of the current chroma block. The video coding method and the apparatus perform weighted combination on the first predictor and the second predictor.Type: ApplicationFiled: December 6, 2023Publication date: May 9, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Byeung Woo Jeon, Bum Yoon Kim, Jee Hwan Lee, Seung Wook Park, Jin Heo
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Patent number: 11945864Abstract: A monoclonal antibody or an antigen-binding fragment thereof according to an embodiment of the present invention can bind to lymphocyte-activation gene 3 (LAG-3) including a heavy chain variable region and a light chain variable region and inhibit the activity thereof. Thus it is expected to be useful for the development of immunotherapeutic agents for various disorders that are associated with LAG-3.Type: GrantFiled: June 28, 2019Date of Patent: April 2, 2024Assignee: Y-BIOLOGICS INC.Inventors: Sang Pil Lee, Ji-Young Shin, Sunha Yoon, Yunseon Choi, Jae Eun Park, Ji Su Lee, Youngja Song, Gisun Baek, Seok Ho Yoo, Yeung-chul Kim, Dong Jung Lee, Bum-Chan Park, Young Woo Park
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Publication number: 20240107808Abstract: A light emitting display device includes: a light emitting element; a second transistor connected to a scan line; a first transistor which applies a current to the light emitting element; a capacitor connected to a gate electrode of the first transistor; and a third transistor connected to an output electrode of the first transistor and the gate electrode of the first transistor. Channels of the second transistor, the first transistor, and the third transistor are disposed in a polycrystalline semiconductor layer, and a width of a channel of the third transistor is in a range of about 1 ?m to about 2 ?m, and a length of the channel of the third transistor is in a range of about 1 ?m to about 2.5 ?m.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Inventors: Keun Woo KIM, Tae Wook KANG, Han Bit KIM, Bum Mo SUNG, Do Kyeong LEE, Jae Seob LEE
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Patent number: 11327211Abstract: An asymmetric transmission film including a body having a first surface and a second surface opposite to the first surface and a transmittance control member disposed in the body such that a forward transmittance of light passing in a direction from the first surface toward the second surface and a reverse transmittance of light passing in a direction from the second surface toward the first surface are different from each other.Type: GrantFiled: January 26, 2018Date of Patent: May 10, 2022Inventors: Jin Suk Song, Sang Choll Han, Sung Hak Bae, Byung Mook Kim, Bum Woo Lee
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Patent number: 10665472Abstract: The present invention relates to a system and a method of removing a foreign material by using an electric field adsorbing scheme, which are capable of easily adsorbing and removing a foreign material on a surface of a film by using an electric field adsorbing scheme through a micro-current (several micro ampere) voltage driving method, not a surface treatment method, such as plasma discharge processing, corona discharge processing, and air blowing processing, which causes damage to the surface of the film, in a processing process for removing the foreign material on the surface of the film, and particularly, which exclude high pressure discharge processing and the like, thereby decreasing an incurrence rate of a safety accident of an operator and preventing a surface of a film from being scratched.Type: GrantFiled: March 28, 2017Date of Patent: May 26, 2020Assignee: LG CHEM, LTD.Inventors: Dongmyung Shin, Sang Ki Chun, Bum Woo Lee
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Publication number: 20190353835Abstract: An asymmetric transmission film including a body having a first surface and a second surface opposite to the first surface and a transmittance control member disposed in the body such that a forward transmittance of light passing in a direction from the first surface toward the second surface and a reverse transmittance of light passing in a direction from the second surface toward the first surface are different from each other.Type: ApplicationFiled: January 26, 2018Publication date: November 21, 2019Applicant: LG Chem, Ltd.Inventors: Jin Suk Song, Sang Choll Han, Sung Hak Bae, Byung Mook Kim, Bum Woo Lee
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Publication number: 20180114701Abstract: The present invention relates to a system and a method of removing a foreign material by using an electric field adsorbing scheme, which are capable of easily adsorbing and removing a foreign material on a surface of a film by using an electric field adsorbing scheme through a micro-current (several micro ampere) voltage driving method, not a surface treatment method, such as plasma discharge processing, corona discharge processing, and air blowing processing, which causes damage to the surface of the film, in a processing process for removing the foreign material on the surface of the film, and particularly, which exclude high pressure discharge processing and the like, thereby decreasing an incurrence rate of a safety accident of an operator and preventing a surface of a film from being scratched.Type: ApplicationFiled: March 28, 2017Publication date: April 26, 2018Inventors: Dongmyung SHIN, Sang Ki CHUN, Bum Woo LEE
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Patent number: 8042593Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.Type: GrantFiled: July 17, 2008Date of Patent: October 25, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Cheal-Sang Yoon, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim
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Publication number: 20090035105Abstract: Provided are an apparatus, method for separating a chip and a method for fabricating the apparatus. An apparatus for separating a chip, according to example embodiments, may include a suction holder. The suction holder may include an upper surface with at least one suction hole to suction and fix an adhesive tape to which a plurality of semiconductor chips may be attached. The apparatus for separating a chip may also include a rotatable plunger in the suction holder. The rotatable plunger may include an upper end configured to pass through the at least one suction hole and to project over the suction holder upon rotation of the rotatable plunger. The apparatus for separating a chip may also include a vertically movable plunger lifter. The vertically movable plunger lifter may be configured to rotate the rotatable plunger by contacting and raising a lower end of the rotatable plunger.Type: ApplicationFiled: July 25, 2008Publication date: February 5, 2009Inventors: Cheal-Sang Yoon, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Young-Gon Hwang, Mok-Kun Kwon
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Publication number: 20090020229Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip a parallel state with a lead frame when applying a bonding load.Type: ApplicationFiled: July 17, 2008Publication date: January 22, 2009Applicant: Samsung Electronics Co., Ltd.Inventors: Cheal-Sang YOON, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim
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Publication number: 20080000587Abstract: A bonding apparatus for a semiconductor package determines whether a bottom of a bonding head is contaminated, and may include a contamination detecting unit for a bonding head attached to a body to apply pressure to the semiconductor package. The contamination detecting unit is below the bonding head to detect contamination on the bottom of the bonding head, a bonding block, and a bonding stage.Type: ApplicationFiled: February 26, 2007Publication date: January 3, 2008Inventors: Yong-dae Ha, Cheal-sang Yoon, Jeong-soon Cho, Bum-woo Lee, Young-gon Hwang, Mok-kun Kwon
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Patent number: 6090220Abstract: A method for transferring a wafer alternately uses a gas providing device and a vacuum generating device. The method includes decontaminating a wafer by contacting a wafer supporter having a wafer provided thereon with a positive pressure mediated stream of gas provided from suction cups of a transferring assembly, where the suction cups are connected to the gas providing device through a gas transmitting tube. After decontamination, the wafer supporter is vacuum adhered to the transferring assembly by contacting the wafer supporter with the suction cups, where the suction cups are connected to the vacuum generating device through the gas transmitting tube. Because the wafer is transferred by picking up the wafer supporter after removing waste washing solution from the wafer and wafer supporter, breakdown and performance deterioration of the transferring assembly is prevented.Type: GrantFiled: February 5, 1998Date of Patent: July 18, 2000Assignee: Samsung Electronics Co., Ltd.Inventors: Dea Won Kim, Sam Bok Jang, Kouk Jin Oh, Bum Woo Lee