Abstract: The present invention relates to an optical coupling module for optically coupling an optical fiber with an optical waveguide, and a method of fabricating the optical coupling module. In an optical coupling module for optically coupling an optical network with a planar lightwave circuit (PLC), an etched groove for disposition of the optical fiber and an etched groove for mounting of the optical waveguide are exposed using a mask having mask patterns that are aligned with each other, and then anisotropically etched. By doing so, the two grooves can be precisely aligned with each other at one time, compared with a conventional method in which an exposure process is carried out two or more times. Accordingly, an inexpensive structure having high optical coupling efficiency upon manual alignment can be obtained.

Abstract: The present invention relates to an optical coupling module for optically coupling an optical fiber with an optical waveguide, and a method of fabricating the optical coupling module. In an optical coupling module for optically coupling an optical network with a planar lightwave circuit (PLC), an etched groove for disposition of the optical fiber and an etched groove for mounting of the optical waveguide are exposed using a mask having mask patterns that are aligned with each other, and then anisotropically etched. By doing so, the two grooves can be precisely aligned with each other at one time, compared with a conventional method in which an exposure process is carried out two or more times. Accordingly, an inexpensive structure having high optical coupling efficiency upon manual alignment can be obtained.

Abstract: The present invention relates to an optical coupling module for optically coupling an optical fiber with an optical waveguide, and a method of fabricating the optical coupling module. In an optical coupling module for optically coupling an optical network with a planar lightwave circuit (PLC), an etched groove for disposition of the optical fiber and an etched groove for mounting of the optical waveguide are exposed using a mask having mask patterns that are aligned with each other, and then anisotropically etched. By doing so, the two grooves can be precisely aligned with each other at one time, compared with a conventional method in which an exposure process is carried out two or more times. Accordingly, an inexpensive structure having high optical coupling efficiency upon manual alignment can be obtained.

Abstract: This invention is related to a semiconductor light emitting device integrated with a Si-heat sink which contains not only a beam deflector but also the driving integrated circuits. A semiconductor light emitting device comprising a Si-substrate 2, V-groove 3 etched into substrate 2 and a beam deflector 9 on the wall of V-groove 3 wherein the transistor 22 for the driving and control on said Si-substrate is integrated so that light emitting device 1 and said integrated circuit are integrally mounted. The advantage of this invention is that the integration of the driving transistor with the light emitting device in the same package head reduces the packaging and bonding problems. Obtained is a compact optical system which easily radiates the heat dissipated by devices. This is in contrast to conventional light emitting devices which use the Si-substrate only as a mount and beam deflector.

Abstract: A light emitting apparatus in a head of an non-impact printer using an array-mode semiconductor light emitting device and emitting a radiant light in parallel to the surface of a substrate. The improved device is capable of easily arranging a head substrate, a lens system, and a drum on a central axis thereof by adopting a method of emitting a light in parallel to said head substrate. To achieve the object the device comprises: a reflecting surface 8 formed by shaving one corner of a substrate 6 in a given angle of slope; a plurality of strip wires (W11, W12, . . . ) disposed, in parallel and a fixed interval, on uppermost surface 11 of the substrate 6, said wires each extending towards said corner from the opposite side thereof; a common electrode wire 4 disposed on said uppermost surface in parallel with said wires; and a plurality of light emitting means each disposed lowermost surface of a plurality of light emitting chips (C1, C2, . . .