Patents by Inventor Bun YU

Bun YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9031631
    Abstract: A head-mountable EEG electrode-containing device is provided based on radially adjustable electrodes to fit the wearer's unique head size and shape. The head-mountable device with an electrode array positioned therein includes multiple head-mountable device sections that are interconnected by mechanical fasteners to facilitate sizing and positioning of the head-mountable device. An array of resilient sleeves is positioned within each head-mountable device section. Each resilient sleeve houses an individual electrode and is deformable for self-orienting. The deformation of the sleeve is such that a central axis passing through the individual electrode housed within the resilient sleeve is maintained in a position approximately normal to a plane tangential to a scalp portion positioned beneath that electrode.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: May 12, 2015
    Assignee: The Hong Kong Polytechnic University
    Inventors: Kai Yu Tong, Bun Yu, Peter Man Kit Pang, Newmen Sze Kit Ho, Xiaoling Hu, Robert Wai Man Tam, Shu To Ng
  • Publication number: 20140213874
    Abstract: A head-mountable EEG electrode-containing device is provided based on radially adjustable electrodes to fit the wearer's unique head size and shape. The head-mountable device with an electrode array positioned therein includes multiple head-mountable device sections that are interconnected by mechanical fasteners to facilitate sizing and positioning of the head-mountable device. An array of resilient sleeves is positioned within each head-mountable device section. Each resilient sleeve houses an individual electrode and is deformable for self-orienting. The deformation of the sleeve is such that a central axis passing through the individual electrode housed within the resilient sleeve is maintained in a position approximately normal to a plane tangential to a scalp portion positioned beneath that electrode.
    Type: Application
    Filed: January 31, 2013
    Publication date: July 31, 2014
    Applicant: THE HONG KONG POLYTECHNIC UNIVERSITY
    Inventors: Kai Yu TONG, Bun YU, Peter Man Kit PANG, Newmen Sze Kit HO, Xiaoling HU, Robert Wai Man TAM, Shu To NG
  • Patent number: D1025472
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 30, 2024
    Assignee: Dyson Technology Limited
    Inventors: Simon Brian McNamee, Edward Sebert Maurice Shelton, Clément Bernard Christmann, Wee Guan Tan, Bun Tiong Chua, Min Yu Nicole Chian, Paul Thomas Brittell, Be Seng Lok, Gerald Eng, Stephen Benjamin Courtney, Peter David Gammack, Leanne Joyce Garner, Laura Anne Howard
  • Patent number: D1025473
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 30, 2024
    Assignee: Dyson Technology Limited
    Inventors: Simon Brian McNamee, Edward Sebert Maurice Shelton, Clément Bernard Christmann, Wee Guan Tan, Bun Tiong Chua, Min Yu Nicole Chian, Paul Thomas Brittell, Be Seng Lok, Gerald Eng, Stephen Benjamin Courtney, Peter David Gammack, Leanne Joyce Garner, Laura Anne Howard