Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

Abstract: In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

Abstract: The object of the invention is to enable the input of the data of a high energy part and the data of a low energy part to one memory in a thermal head having heating means for heating by different energy. To achieve the object, in a thermal head provided with a shift register to which first energy print data the printing by first energy of which is controlled by heating control means is written and to which second energy print data the printing by second energy of which is controlled by the heating control means is written, the shift register is provided with first shift register elements to which first energy print data is written and second shift register elements to which second energy print data is written, and the first shift register elements and the second shift register elements are connected in series.

Abstract: A multi power type thermal head which has a heating element for producing heat with different energies, an added resistor being connected to the heating element, first switch element for controlling the heating element in an operation state or a nonoperational state, and second switch element for controlling the heating element and the added resistor in an operation state or a nonoperational state. To control the thermal head in a first energy state, heating the heating element is controlled by the first switching element. To control the thermal head in a second energy state, the heating element and the added resistor are controlled by the second switching element with the heating element and the added resistor connected in series.