Patents by Inventor Bunta Okamoto

Bunta Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11439005
    Abstract: An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 6, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Isamu Morita, Bunta Okamoto
  • Patent number: 11380474
    Abstract: An electronic device includes an inductor bridge that connects first and second circuits. The inductor bridge includes an insulating base material and a conical coil in the insulating base material. The conical coil includes loop shaped conductors arranged in a winding axis direction. Inner and outer diameters of the loop shaped conductors change is one way in the winding axis direction. A large-diameter loop shaped conductor, which is one of the loop shaped conductors that has the largest inner and outer diameters, is disposed such that the inner and outer diameters thereof relatively extend along the insulating base material compared with the other loop shaped conductors when the inductor bridge is bent.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: July 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Bunta Okamoto, Kuniaki Yosui
  • Patent number: 10867747
    Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: December 15, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Noboru Kato, Yuki Wakabayashi, Bunta Okamoto, Naoto Ikeda, Takeshi Kurihara
  • Patent number: 10476133
    Abstract: An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: November 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Bunta Okamoto, Isamu Morita, Satoshi Ishino, Jun Sasaki, Yoshihito Otsubo, Keisuke Araki, Norio Sakai
  • Publication number: 20190116659
    Abstract: An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 18, 2019
    Inventors: Isamu MORITA, Bunta OKAMOTO
  • Publication number: 20190103213
    Abstract: An electronic device includes an inductor bridge that connects first and second circuits. The inductor bridge includes an insulating base material and a conical coil in the insulating base material. The conical coil includes loop shaped conductors arranged in a winding axis direction. Inner and outer diameters of the loop shaped conductors change is one way in the winding axis direction. A large-diameter loop shaped conductor, which is one of the loop shaped conductors that has the largest inner and outer diameters, is disposed such that the inner and outer diameters thereof relatively extend along the insulating base material compared with the other loop shaped conductors when the inductor bridge is bent.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 4, 2019
    Inventors: Bunta OKAMOTO, Kuniaki YOSUI
  • Publication number: 20190043666
    Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.
    Type: Application
    Filed: October 4, 2018
    Publication date: February 7, 2019
    Inventors: Kuniaki YOSUI, Noboru KATO, Yuki WAKABAYASHI, Bunta OKAMOTO, Naoto IKEDA, Takeshi KURIHARA
  • Patent number: 10128040
    Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: November 13, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Noboru Kato, Yuki Wakabayashi, Bunta Okamoto, Naoto Ikeda, Takeshi Kurihara
  • Patent number: 10123414
    Abstract: A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Bunta Okamoto, Isamu Morita, Jun Sasaki
  • Patent number: 10097157
    Abstract: A crystal vibrating device that includes a crystal resonator mounted on a substrate by a first conductive adhesive layer and a second conductive adhesive layer, and, when the first conductive adhesive layer and the second conductive adhesive layer are viewed in a plan view, the first conductive adhesive layer and the second conductive adhesive layer each have a) a planar shape in which two circles or ellipses are partly superimposed upon each other, b) two conductive adhesive layer portions that are separated from each other, or c) a length direction and an aspect ratio, which is a ratio between a maximum size in the length direction and a maximum size in a width direction that is orthogonal to the maximum size in the length direction, is in a range of 1.5 to 3.0.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: October 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Bunta Okamoto, Motoyoshi Sakai
  • Publication number: 20170229235
    Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.
    Type: Application
    Filed: April 24, 2017
    Publication date: August 10, 2017
    Inventors: Kuniaki YOSUI, Noboru KATO, Yuki WAKABAYASHI, Bunta OKAMOTO, Naoto IKEDA, Takeshi KURIHARA
  • Patent number: 9729124
    Abstract: A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: August 8, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Bunta Okamoto, Hidekazu Oishibashi
  • Publication number: 20170188459
    Abstract: A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.
    Type: Application
    Filed: February 27, 2017
    Publication date: June 29, 2017
    Inventors: Kuniaki YOSUI, Bunta OKAMOTO, Isamu MORITA, Jun SASAKI
  • Patent number: 9666352
    Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: May 30, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Noboru Kato, Yuki Wakabayashi, Bunta Okamoto, Naoto Ikeda, Takeshi Kurihara
  • Patent number: 9627735
    Abstract: A high-frequency signal line includes a dielectric base with a first line portion and a second line portion each extending along a predetermined straight line parallel or substantially parallel to a predetermined direction, and a third line portion mutually connecting first side ends of the first line portion and the second line portion in the predetermined direction, a signal line, a first ground conductor located on the first side in the layer stacking direction of the signal line, a second ground conductor located on a second side in the layer stacking direction of the signal line, and one or more interlayer connection conductors connecting the first ground conductor and the second ground conductor. In the third line portion, the interlayer connection conductor is provided on the second side in the predetermined direction of the signal line when viewed from the layer stacking direction.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: April 18, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuki Wakabayashi, Bunta Okamoto, Satoshi Sasaki
  • Publication number: 20160372819
    Abstract: An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 22, 2016
    Inventors: Bunta OKAMOTO, Isamu MORITA, Satoshi ISHINO, Jun SASAKI, Yoshihito OTSUBO, Keisuke ARAKI, Norio SAKAI
  • Publication number: 20160268666
    Abstract: A high-frequency signal line includes a dielectric base with a first line portion and a second line portion each extending along a predetermined straight line parallel or substantially parallel to a predetermined direction, and a third line portion mutually connecting first side ends of the first line portion and the second line portion in the predetermined direction, a signal line, a first ground conductor located on the first side in the layer stacking direction of the signal line, a second ground conductor located on a second side in the layer stacking direction of the signal line, and one or more interlayer connection conductors connecting the first ground conductor and the second ground conductor. In the third line portion, the interlayer connection conductor is provided on the second side in the predetermined direction of the signal line when viewed from the layer stacking direction.
    Type: Application
    Filed: May 20, 2016
    Publication date: September 15, 2016
    Inventors: Yuki WAKABAYASHI, Bunta OKAMOTO, Satoshi SASAKI
  • Publication number: 20160043702
    Abstract: A crystal vibrating device that includes a crystal resonator mounted on a substrate by a first conductive adhesive layer and a second conductive adhesive layer, and, when the first conductive adhesive layer and the second conductive adhesive layer are viewed in a plan view, the first conductive adhesive layer and the second conductive adhesive layer each have a) a planar shape in which two circles or ellipses are partly superimposed upon each other, b) two conductive adhesive layer portions that are separated from each other, or c) a length direction and an aspect ratio, which is a ratio between a maximum size in the length direction and a maximum size in a width direction that is orthogonal to the maximum size in the length direction, is in a range of 1.5 to 3.0.
    Type: Application
    Filed: October 22, 2015
    Publication date: February 11, 2016
    Inventors: BUNTA OKAMOTO, Motoyoshi Sakai
  • Publication number: 20150294781
    Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.
    Type: Application
    Filed: June 24, 2015
    Publication date: October 15, 2015
    Inventors: Kuniaki YOSUI, Noboru KATO, Yuki WAKABAYASHI, Bunta OKAMOTO, Naoto IKEDA, Takeshi KURIHARA
  • Publication number: 20150200647
    Abstract: A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.
    Type: Application
    Filed: March 26, 2015
    Publication date: July 16, 2015
    Inventors: Bunta OKAMOTO, Hidekazu Oishibashi