Abstract: To eliminate galvanic corrosion, a housing includes a clad material. The clad material includes an interior metal disposed within an exterior metal. The exterior metal is different from the interior metal. The housing further includes a clad interface and a melt interface. The melt interface includes a layer of hardened flux disposed on a portion of the interior metal.

Abstract: An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

Abstract: An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

Abstract: A deep black housing for a handheld electronic device is disclosed having one or more high resolution, bleached markings. The bleached markings are significantly lighter than the housing and exhibit a smooth appearance. Methods for preparing a housing having the finish and markings are also disclosed, including housings for use in mobile phones.

Abstract: A deep black housing for a handheld electronic device is disclosed having one or more high resolution, bleached markings. The bleached markings are significantly lighter than the housing and exhibit a smooth appearance. Methods for preparing a housing having the finish and markings are also disclosed, including housings for use in mobile phones.

Abstract: A plurality of solar cells is connected together in a shingled fashion. Each of the solar cells includes grid wires that are attached to an electrode of the solar cell so as to receive charge carriers produced when photons are absorbed by the solar cell. The grid wires are then interconnected with adjacent solar cells when the solar cells are shingled together. The grid wires may be applied to the solar cells via a laminate and the electrical interconnection of the grid wires may be achieved by the use of a conductive epoxy.

Abstract: A photovoltaic module comprises a first group of solar cells; a second group of solar cells; a first interconnection member extending across a first surface of the first group of solar cells and across a first surface of the second group of solar cells to connect the first and second groups of solar cells in parallel; and a second interconnection member extending across a second surface of the first group of solar cells and across a second surface of the second group of solar cells.

Abstract: A photovoltaic module comprises a first bypass diode and a first group of solar cells connected to the first bypass diode. The first group of solar cells comprises a first solar cell, a second solar cell connected in series to the first solar cell, and a third solar cell connected in parallel to the first solar cell.

Abstract: A flexible solar cell assembly having solar cells that are positioned within a sealed module chamber. A sealed wiring chamber is positioned on an end of the sealed module chamber and is interposed between the sealed module chamber and a junction box. Wiring interconnecting the junction box to the solar cells in the sealed module chamber is routed through the sealed wiring chamber to inhibit water entry into the sealed module chamber via the wiring.

Abstract: A flexible solar cell assembly having solar cells that are positioned within a sealed module chamber. A sealed wiring chamber is positioned on an end of the sealed module chamber and is interposed between the sealed module chamber and a junction box. Wiring interconnecting the junction box to the solar cells in the sealed module chamber is routed through the sealed wiring chamber to inhibit water entry into the sealed module chamber via the wiring.

Abstract: A flexible solar cell assembly having solar cells that are positioned within a sealed module chamber. A sealed wiring chamber is positioned on an end of the sealed module chamber and is interposed between the sealed module chamber and a junction box. Wiring interconnecting the junction box to the solar cells in the sealed module chamber are routed through the sealed wiring chamber to inhibit water entry into the sealed module chamber via the wiring.

Abstract: The inventions described herein generally relate to photovoltaic or solar module design and fabrication and, more particularly, to modules utilizing thin film solar cells. In one aspect is described a solar module and method of making the same that has a shield material that is both an electrical insulator and a moisture barrier provided at a location corresponding to at least one hole that is used to route a wiring member, such that the shield material seals the at least one hole against moisture entering into the internal space and electrically insulates the wires of the wiring member from the at least one metallic layer of the back protective sheet.

Abstract: The present invention provides module structures and methods of manufacturing rigid or flexible photovoltaic modules employing thin film solar cells fabricated on flexible substrates, preferably on flexible metallic foil substrates. The solar cells may be Group IBIIIAVIA compound solar cells or amorphous silicon solar cells fabricated on thin stainless steel or aluminum alloy foils. In one embodiment, initially a solar cell string including two or more solar cells is formed by interconnecting the solar cells with conductive leads or ribbons. At least one bypass diode electrically connects conductive back surfaces of at least two solar cells. The bypass diode and the solar cells are encapsulated with support material and are packed with the protective shell such that the at least one bypass diode is placed between at least one solar cell and the bottom protective sheet.

Abstract: Embodiments of the present inventions provide structures and methods for manufacturing high electrical conductivity grid patterns having minimum shadowing effect on the illuminated side of the solar cells. To manufacture a conductive grid for a solar cell, a first conductive layer is initially formed over a transparent conductive oxide layer of a solar cell. The first conductive layer has a pattern including a busbar and fingers connected to the busbar. Next, a second conductive layer is formed on the first conductive layer. In one embodiment, the first conductive layer includes silver and the second conductive layer includes carbon nano tube material, or the first conductive layer includes carbon nano tube material and the second conductive layer includes silver.

Abstract: An apparatus for and a method of interconnecting at least two solar cells using contact areas which are formed on the conductive substrates of the solar cells is described. The contact areas are formed by a material removal process which removes high resistance surface layers of the conductive substrates at the contact areas. A stringing process serially interconnects the solar cells by connecting each contact area that is cleared of high resistance surface layer to the terminal of one of the adjacent solar cells.

Abstract: A method for encapsulating interconnected solar cells including Group IBIIIAVIA absorbers and an apparatus according to the same, whereby a light receiving side encapsulant layer including thermoplastic polyurethane is used to cover the light receiving sides of the interconnected solar cells. The back sides of the interconnected solar cells are covered with a back side encapsulant layer that is different from the light receiving side encapsulant layer.